HAWK 8220WS
High Precision Micro-bump Bond Test System

The state-of-the-art wafer level bond tester, HAWK-8220WS, is a fully automatic wafer bond tester that can be easily in-lined with the India Handotai WH series, an automated wafer handler EFEM robot. Micro bump shear and CBP tests are performed by precisely handling 8-12” wafers, and sophisticated automatic bump shear tests are performed by loading wafer mapping files from the network. For small wafers under 8”, fully automatic wafer handling is possible by combining the bench top wafer loader IH WL200S

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Description

  • Bond test system exclusively for Wafer level package
  • Specialized testing of micro bumps through sophisticated XYZ control
  • Micro bump ball shear & CBP test
  • Automatic Wafer handling through easy coupling with India Handotai EFEM handler
  • Automatic shear based on wafer map data test option
  • 12” Wide stage capable of handling wafers
  • 8”/12” wafer combined Wafer chuck
  • Automatic high-speed movement when clicking on a specific position on the Wafer image in the program with nevigation function
  • User-friendly latest GUI program and all-in -one test page menu
  • Ultra-precision no-load floor touch shear height control, ± 1um
  • Various customer-customized options: Image capture, ball height measurement, automatic shear test, ionizer & etc.
  • Right Joystick button – test start key, left Joystick button – XY stage speed variable, ultra high/ultra low speed Test
    speed , shear test height, tool landing speed, overtravel, grade list & test conditions can be easily fine-tuned
  • Application of the latest GUI OS program technology based on Window
  • Basic installation of TCP/IP, SEC/GEM communication function Test method based on international semiconductor test regulations (JEDEC, MILS, EIA)

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