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Your End-to-End Semiconductor Materials Partner
Empowering semiconductor innovation with stable supply of advanced engineering materials sourced from recognized global leaders.
- Product Categories
From Silicon Powder to Package — Materials for Advanced Semiconductors
WAFER FAB
Advanced materials engineered for ingot and wafer processing, enabling high precision, high purity, and high yield.
DEVICE FAB
Specialized materials supporting front-end semiconductor device fabrication, ensuring reliability, performance, yield and scalability.
OSAT / ATMP FAB
High-performance materials tailored for outsourced semiconductor assembly, packaging and test, optimized for high throughput and consistency.
OTHERS
Dedicated materials and solutions designed to support adjacent electronics manufacturing like display fabs, glass wafer fabs, etc.
- About Us
Your One-Stop Shop for
Semiconductor Manufacturing Materials
‘Handotai’ means semiconductor in Japanese. We fulfil all your material needs for semiconductor manufacturing and packaging including raw materials, consumables, machines and spare parts.
Our customers span across the value chain from wafer fabs, device fabs, OSAT/ATMP companies as well as other areas like display fabs, solar manufacturers, etc.
- Popular Products
Powering Semiconductor Innovation with Advanced Materials
- Paranoid Partners
While everybody remembers that
“The number of transistors on a microchip doubles approximately every two years, driving exponential growth in computing power”
Gordon Moore
Very few remember that
“only the paranoid survive.”
Andrew Grove
- Our Customers
We are a global supplier of semiconductor materials
We specialize in delivering high-quality semiconductor manufacturing materials to front-end and back-end manufacturers across the globe, ensuring innovation and reliability.
- Transparency
- Innovation
- Results-Driven
- Client-Centric
- Integrity
- Accountability
- Collaboration
- Excellence
- Contact Us
Let’s solve your semiconductor materials challenge
From wafer fabrication to advanced packaging, our materials are engineered to meet the most demanding process and reliability requirements.
Whether you are optimizing yield in front-end processes, improving reliability in device fabrication, or scaling throughput in OSAT environments, our team can support you with the right materials and technical insight.
Fast response | Application-focused recommendations | Global sourcing capability.