WARP™ WP SERIES
Automatic Wide FOV One-Shot Warpage Metrology​

WARP WP series large-area 3D surface shape scanning equipment measures the surface shape of a 300mm wafer at a high speed within 1.5 seconds.

Based on the large-area surface scan technology of the DPM ( Digital Pattern Moiré ) sensor method , it is possible to detect surface defects such as scratches, cracks, particles, dents, and curls on the surface with high resolution while precisely measuring the 3D shape. By optimizing the basic DPM sensor module as a measurement environment in-situ instrument, we manufacture and supply customized metrology as tabletop/standalone/full-automatic in-line system.