WARP™ RT SERIES
Automatic Wide FOV One-Shot Warpage Metrology
(Thickness, Warpage, Roughness & 3D CD Measurement )

The WARP™ RT series is a hybrid one metrology device that can continuously measure wafer thickness, warpage, surface roughness, and Micro 3D CD values ​​by applying Combined Multi-Sensor technology. It is a state-of-the-art composite wafer measurement facility that achieves maximum measurement time, cost, and space efficiency, as it can perform not only wafer shape but also micro 3D dimension measurement in one device.