High-resolution thickness and flatness (TTV) gauge for 300–450mm silicon wafers.
Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX 1018 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV) especially after grinding and lapping. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer which consist of hundreds of local thickness
values. If necessary for your application, the four standard scans can be simply increased to reach an even higher measuring coverage. Comes with our powerful MX-NT operating software.
Thickness | Flatness (TTV)
| Wafer Diameter | 300mm, 450mm |
| Accuracy | ±0.3 µm |
| Resolution | 10nm |
| Spartial resolution | 1mm |
| Scans | up to 8 |
| Software | MXNT |
| MX 102-6 | MX 102-8 | MX 1012 | MX 1018 | |
| Wafer Diameter | 4“, 5“, 6“ | 6“, 8“ | 8″, 12″ | 12″, 18″ |
| Accuracy | ±0.1 µm | ±0.1 µm | ±0.1 µm | ±0.3 µm |
| Resolution | 10nm | 10nm | 10nm | 10nm |
| Spartial Resolution | 1mm | 1mm | 1mm | 1mm |
| Scans | 4 | 4 | up to 8 | up to 8 |
| Dynamic Range | 100 or 350µm | 100 or 350µm | 100 or 350µm | 100 or 350µm |
| Software | MXNT | MXNT | MXNT | MXNT |
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