Description
Product Features
Wafer Diameter | up to 200mm |
Thickness Accuracy | ±0.5µm |
Resolution | 10nm |
Dynamic range | 800µm |
Thickness range | default 200 – 1000 µm |
Software | EHMaster |
Easy one-point thickness gauge for 30–200mm semiconducting and metallic materials.
The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display.Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Thickness
Wafer Diameter | up to 200mm |
Thickness Accuracy | ±0.5µm |
Resolution | 10nm |
Dynamic range | 800µm |
Thickness range | default 200 – 1000 µm |
Software | EHMaster |