WARP™ WT 3500
Automatic Wafer Shape (Thickness, Warpage) Metrology

India Handotai’ unique WARP WT3500 is a non-contact cutting-edge technology wafer shape measurement device that automatically measures wafer thickness, warpage and bow with sub-micron precision by calling a multi-point E-map recipe and one-click. It is possible to measure up to 300mm wafers under various semiconductor manufacturing process conditions, such as ring framed wafers and bare wafers, with the highest repeatability measurement accuracy (≤ ± 0.5㎛), and the sensor is safely detected with the smart wafer search function to preserve the quality of measurement wafer specimens. Proximity to perform non-contact high-speed measurement.