MX 203-4-21

Application

Fast contactless geometry gauge for 2–4″ silicon wafers.

High throughput: the MX203-4-21 gauges with its 21 measuring points every wafer within max. 5 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type

Thickness | Flatness (TTV) | Bow | Warp