Category:

Thermal Release Tape

Thermal Release Tape

Product Detail

Thermal Release Tape / Thermal Dicing Tape (Film) / Thermal Release Tape (Film)

Model : FCL

♠ Main applications are for protection or carrier.

♠ Provides enough holding adhesion during dicing operation at regular temperature, objects are not moved, nor flying. Easily released after heating.

♠ Thermal release temperature:85℃, 90℃, 120℃, 150℃, 190℃ or the highest temperature 260℃.

♠ For wafer dicing, chip dicing, sputtering process, MLCC dicing, LED dicing, substrate cutting, lens cutting, nameplate cutting or any semiconductor Industry production process.

Thermal Release Tape 1

Model

Material

Physical Property

Applications

FCL70810-1

PET Film w/ Liner

Total Thickness

150 ± 8

µm

Release Temperature

85℃ , 3-5 min

Adhesion

Before Heating

0.6 ↑

kg/in

Adhesion

After Heating

0.015 ↓

kg/in

FCL70950

PET Film w/ Liner

Total Thickness

95 ± 5

µm

Release Temperature

90℃ , 3-5 min

Adhesion

Before Heating

0.4-0.7

kg/in

Adhesion

After Heating

0.015 ↓

kg/in

FCL90980-1

PET Film w/ Liner

Total Thickness

125 ± 7

µm

Release Temperature

100℃ , 3-5 min

Adhesion

Before Heating

1.2 ↑

µm

Adhesion

After Heating

0.015 ↓

kg/in

FCL125-6

PET Film w/ Liner

Total Thickness

130 ± 7

µm

Release Temperature

120℃ , 3-5 min

Adhesion

Before Heating

1.0 ↑

kg/in

Adhesion

After Heating

0.015↓

kg/in

FCL71538-6

PET Film w/ Liner

Total Thickness

91 ± 5

µm

Release Temperature

150℃ , 3-5 min

Adhesion

Before Heating

0.4 ↑

kg/in

Adhesion

After Heating

0.015↓

kg/in

FCL72010

PET Film w/ Liner

Total Thickness

150 ± 8

µm

Release Temperature

200℃ , 3-5 min

Adhesion

Before Heating

0.3 ↑

kg/in

Adhesion

After Heating

0.015↓

kg/in