UV Dicing Release Tape
Product Detail
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)
Model : UET / UPT
♠ After UV light exposure (with certain wave length), the adhesion is greatly reduced (irreversible reaction), the object can be easily removed and picked up.
♠ Good for heat resistant purposes.
♠ Used in wafer back grinding, chip dicing, MLCC cutting, LED dicing, lens dicing, nameplate cutting and any substrate cutting.
♠ Anti-static version is available.
Model | Material | Physical Property | Applications | ||
UET101 | PET Film+Liner | Total Thickness | 125 | µm | Semiconductor Dicing |
Before UV Release | 2↑ | kg/in | |||
After UV Release | 0.03↓ | kg/in | |||
UET113P | PET Film+Liner | Total Thickness | 110 | µm | |
Before UV Release | 0.9 ↑ | kg/in | |||
After UV Release | 0.03 ↓ | kg/in | |||
UET123P | PET Film+Liner | Total Thickness | 125 | µm | |
Before UV Release | 2.0 ↑ | kg/in | |||
After UV Release | 0.03↓ | kg/in | |||
UPT155 | PO Film + Liner | Total Thickness | 170 | µm | |
Before UV Release | 1.2↑ | kg/in | |||
After UV Release | 0.05 ↓ | kg/in | |||
UPT152-11 | PO Film + Liner | Total Thickness | 170 | µm | |
Before UV Release | 1.2↑ | kg/in | |||
After UV Release | 0.05↓ | kg/in | |||
