UV Release Tape Low Energy
Product Detail
UV Low energy version
Model : LE
♠ Used with UV light exposure (with certain wavelength), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed/ picked up after operation.
♠ Good for dicing and heat resistant purposes.
♠ Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, lead frame cutting, LED frame cutting or name plate cutting.
♠ Anti-static version is available.
♠ Low energy release, speed up the production process.
Model | Material | Physical Property | Applications | ||
UPT143LE | PO Film + Liner | Total Thickness | 170 | µm | Dicing, grinding, great expansion |
Before UV Release | 2.5 | kg/in | |||
After UV Release | 0.03 | kg/in | |||
UPT152LE | PO Film + Liner | Total Thickness | 172 | µm | Dicing, grinding, great expansion Lead frame cutting |
Before UV Release | 1.8 ↑ | kg/in | |||
After UV Release | 0.03 ↓ | kg/in | |||
UPT805LE | PO Film + Liner | Total Thickness | 86 | µm | Dicing, great expansion |
Before UV Release | 0.5~0.9 | kg/in | |||
After UV Release | 0.015↓ | kg/in | |||
UPT104LE | PO Film + Liner | Total Thickness | 125 | µm | Dicing, grinding, great expansion Lead frame cutting |
Before UV Release | 1.3 ↑ | kg/in | |||
After UV Release | 0.02 ↓ | kg/in | |||
