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Diamond Wire – Squaring
- High throughput & Superior cutting quality
- Reduced process lead time and kerf loss
- Enhanced flatness of cut materials and superior warp, TTV and Bow values
- Applicable for thin wafer slicing – Through uniform diamond grit
- Longer wire lifetime – Excellent diamond retention & no wire breakage
- Faster cutting speed – 3~10 times compared with slurry process
- Low cost and eco-friendly – Slurry free process
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Diamond Wire-Wafer Slicing
- High throughput & Superior cutting quality
- Reduced process lead time and kerf loss
- Enhanced flatness of cut materials and superior warp, TTV and Bow values
- Applicable for thin wafer slicing – Through uniform diamond grit
- Longer wire lifetime – Excellent diamond retention & no wire breakage
- Faster cutting speed – 3~10 times compared with slurry process
- Low cost and eco-friendly – Slurry free process
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MX 152/153
Application
OEM integrated thickness and resistivity gauge for 125 mm, 156 mm up to 230 mmm solar wafers.The MX152/153 is an in-line module for belt-transported wafers. It gauges thickness, flatness (TTV) and optionally resistivity and P/N dotation on the fly between automated manufacturing processes. Consists of Measurement module, electronic rack and controlling computer. Measurement values will be tranfered to a host computer by ethernet and TCP/IP.
Measurement type
Thickness | Flatness (TTV) | Resistivity| P/N Dotation