• DW160S

    Easy-to-use compact single wire saw

    This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
    It is compact and easy to operate. (Maximum workpiece size: 8 inches)

    Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide

  • DW340S

    Single wire saw capable of cutting long workpieces

    This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
    An optional goniometer stage and Y-axis table for back and forth functions are available.
    (Maximum workpiece size: 13 inches)

    Target workpieces: Silicon, quartz, fluorite, tungsten carbide

  • VECTOR HTI-1.1

    Synthetic Cooolant/Lubricant for Silicon Cropping, Sawing, and Edge-Grinding in Non-Recirculating Applications

    VECTOR HTI-1.1 is a synthetic formulation developed for use in “once-through” processes using diamond blades or diamond wires.

    Application areas:

    • Wafer thinning and backgrinding (BG)
    • Substrate cropping, squaring, and sawing
    • Precision dicing and edge grinding
    • Glass, optics, and ceramic part slicing
    • Solar wafer slicing and surface prep

    5-gallon pails | 55-gallon drums

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