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Epoxy Molding Material
KMC series
KMC series, Shin-Etsu Chemical’s semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications. -
Liquid Epoxy Encapsulation Material
SMC series
SMC series are liquid epoxy encapsulation materials developed for potting materials, adhesives, and underfill materials for semiconductor devices.
The semiconductor device which is protected by this encapsulation material has excellent electrical properties and moisture resistance.
In addition, the low stress properties by using silicone which is Shin-Etsu Chemical’s original technology, shows excellent properties in heat resistance. -
QFN Tape
QFN package tape / QFN Tape / Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature / Molding tape
Application / Heat Press Tape / FPC TapeModel : KAL -
Silicone Molding Compound
SGC series
Shin-Etsu Chemical is offer silicone molding compound which can be thermosetting transfer molding system for electric and electronic parts. It is contained various fillers and additives based on silicone resin. It has excellent heat resistance, cold resistance and degradation resistance. It is shown stable electrical insulation performance because it is not changing properties by temperature and frequency. In addition, mold releasability is excellent.
Shin-Etsu responds to molding material that requires high heat resistance. -
Conventional Mold
Proven molding method using Top Transfer
Capable of up to 12 Chases -
Pick Up Pad
It is a pick-up tool that is used from molding to singulation test and packaging with minimum physical force with stable vacuum structure as a transporting silicon PAD used for semiconductor back process. We manufacture high-quality products from mold making to various shapes of designs.
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M.G.P Mold
● Equal pressure supply and reliable EMC flow with Multi Pot
● Same performance as Automold
● Mini Tablet EMC Applicable -
Automold Chase & Conversion Kit
● Maintain existing facilities and manufacturing necessary parts for package conversion
● Equal quality at a lower cost compared to original production
● Rich history of production of molds and Conversion kits from many Automold Major companies -
Book Mold
● Simple molds for Prototype verification and small-volume production
● Most types of package shapes can be applied
● High levels of molding comparable to mass-production molds -
Mold Spare Parts
● All types of Spare parts are available
● Assurance of high quality based on precision processing technology
● Provide fastest delivery