Your Products
- No products in the cart.
₹0.00
-
Boat Carrier / Boat Magazines / Magazine Cassette
● Product name：Magazine Cassette
● Part number：BO-MC10
● Dimension：317.5(L) x 168(W) x170(H)mm
● Weight：<3000g ● Capacity：10 set IC Boat -
Customized Disco Wafer Frame TJF-C-3
Material: SUS 420 stainless steel
Surface Treatment: Hair Line finish/Glossy finish -
De-Taping Tape
De taping tape, Peeling tape
Model : ETT / SAT -
Dicing Blade
- High accuracy, super thin blade developed by Shinhan Diamond
- Minimized chipping and superior consistence in quality through stringent particle
- Size distribution control
- Improve productivity by high feed speed
- Providing an optimized solution to the customers
-
Double Side Thermal Release Tape
Thermal Release Double Side Tape, Transfer Tape
Model : SDF -
Double Side UV Release Tape
One side UV release adhesive, the other side with thermal release adhesive. Or double side UV release adhesive tape.Model : UDD / UTD -
Electroformed Micro Blade
- High accuracy
- Ultra-thin hub-less blade (~50um) vs Metal bond micro blade (>100um)
- Cutting any hard materials (ex Ceramic package, LTCC, HTCC)
- Advantages of cutting PKG with high abrasive content
- High yield long life time
-
Epoxy Molding Material
KMC series
KMC series, Shin-Etsu Chemical’s semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications. -
Film Frame FOUP (Dicing) / Tape Frame FOUP Plus
● Product name：Frame FOUP Plus
● Part number：CKF300 Plus
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD -
FoPLP FOUP / Panel FOUP / Panel Level Packaging Panel FOUP 510×515
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF512
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：≒25000g
● Capacity：12 PCS
● Glass size：510 x 515mm，Thickness 0.4-3.2mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：25mm -
FoPLP FOUP 510×515 / Panel FOUP / Panel Level Packaging Panel FOUP
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF500-S1
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：19000-22000g
● Capacity：6 PCS
● Glass size：510 x 515mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：50mm -
Frame Airtight Cassette / Wafer Frame Cassette
● Product name：12″ Frame Airtight Cassette
● Part number：FR-C300-A
● Dimension：396.1(L) x 394.0(W) x 188.5(H)mm
● Weight：3300g
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm)
● Material：PC ESD