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TENSOR HTD Series
Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives
Application areas:
-
TENSOR HTD Series
Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives
Application areas:
-
Thermal Release PI Tape
240~260°C thermal release PI tape, single or double sided design
Model : FCL/SDF -
Thermal Release Tape
Thermal Release Tape / Thermal Dicing Tape (Film) / Thermal Release Tape (Film)Model : FCL -
UV Dicing Release Tape
UV Release Tape, Wafer Dicing Tape
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)Model : UET / UPT -
UV Release Tape Low Energy
UV release tape, UV dicing tape
UV Low energy versionModel : LE -
VECTOR HTG
Synthetic Grinding Fluids
Application areas:
5-gallon pails | 55-gallon drums -
Wafer Back Grinding Tape
Wafer Back Grinding Tape, Dicing Tape
Wafer Back Griniding / Wafer Thinning / Wafer Dicing
Model : POL -
Capillary
Dou Yee is a premier total industrial solutions provider in worldwide. It has vast experience in static control, micro-contamination control and various specialized tools and materials required in the semiconductor, disk drive, electronic and other precision technology sectors since 1982.
DOU TEE CAPILLARY IS
– Copper / Gold Wire Capillary
– Long Life Capillary
– High U.S. Energy Transfer
– High Wear Resistance
– High Bending Strength
– Low Frictional Coefficient -
Conventional Mold
Proven molding method using Top Transfer
Capable of up to 12 Chases -
Magnetic Collet
STRENGTH
Memory Semiconductor and Fingerprint Sensor Chip Pick up & Attach improves the void phenomenon. The combined role of back metal makes it easier to remove and attach the tool stably by magnetic force, and maintain flatness in the Attach process.
TECHNOLOGY
We are producing stable and high quality products with precise processing of Back Metal and Silicon Rubber with flatness of less than 50μm.