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Epoxy Molding Material
KMC series
KMC series, Shin-Etsu Chemical’s semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications. -
Film Frame FOUP (Dicing) / Tape Frame FOUP Plus
● Product name：Frame FOUP Plus
● Part number：CKF300 Plus
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD -
FoPLP FOUP / Panel FOUP / Panel Level Packaging Panel FOUP 510×515
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF512
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：≒25000g
● Capacity：12 PCS
● Glass size：510 x 515mm，Thickness 0.4-3.2mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：25mm -
FoPLP FOUP 510×515 / Panel FOUP / Panel Level Packaging Panel FOUP
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF500-S1
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：19000-22000g
● Capacity：6 PCS
● Glass size：510 x 515mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：50mm -
Frame Airtight Cassette / Wafer Frame Cassette
● Product name：12″ Frame Airtight Cassette
● Part number：FR-C300-A
● Dimension：396.1(L) x 394.0(W) x 188.5(H)mm
● Weight：3300g
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm)
● Material：PC ESD -
Frame Airtight Cassette / Wafer Frame Cassette
● Product name：8″ Frame Airtight Cassette
● Part number：FR-C200-A
● Dimension：301(L) x 288(W) x 206.3(H)mm
● Weight：2700g
● Capacity：25 PCS
● Apply for round wafer：8 inch (Ø200mm)
● Material：PC ESD -
Frame FOUP
● Product name：Frame FOUP
● Part number：CKF300
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC+CN -
Frame FOUP Adapter / Tape Frame FOUP 200mm
● Product name：Frame FOUP
● Part number：CKF200
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：8 inch (Ø200mm) Wafer
● Material：PC ESD -
Frame FOUP ADV / Tape Frame FOUP ADV / FOUP ADV
● Product name：Frame FOUP Plus
● Part number：CKF300 ADV
● Dimension：387.0(L) x 392.0(W) x 206(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD -
Frame Light Cassette / Wafer Frame Cassette
● Product name：12″ Frame Light Cassette
● Part number：FR-C300-L
● Dimension：414.0(L) x 394.0(W) x 188.5(H)mm
● Weight：3640g
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD -
HAWK 8000M
Rotating Multi-Cartridge Bond Tester
It is a multi-purpose automatic bond test system that can perform various tests simultaneously by installing up to 4 different load cartridges and automatically replacing cartridges within 3 seconds by clicking the program button.Automatic replacement of Max 4 cartridges within 3 seconds Individual load module installed, if one cartridge is defective, the other load module operates normally Suitable for simultaneous multi-bond test Multipurpose bond tester capable of testing a maximum load of 100Kgf Test precision: < ± 0.15% GUI SW design maximizing user convenience, all-in-one test page Right Joystick button – Test Start key, Left Joystick button – XY stage speed variable, ultra high / ultra low speed Test speed, shear test height, tool landing speed, overtravel, grade list & test conditions can be easily set in fine detail Application of the latest Window- based GUI OS program technology TCP /IP, SEC/GEM communication functions are installed as standard Test methods based on international semiconductor test regulations (JEDEC, MILS, EIA)
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HAWK 8200S
Multi-Purpose Single Cartridge Bond Test System
The next-generation bond tester HAWK-8200S model, which was created based on the field application technology of the 8000 Single bond tester for a long time, provides users with the best work convenience and efficiency, and realizes the best test quality with optimal user-friendly functions and ergonomic desktop equipment. did. Slim, ergonomic design through integrated development of one board control system
One touch position control microscope holder considering various workers
Various size stage options that can be converted by easy attachment/detachment, 50×50, 100×100, 200×200, customized type
High load , Electromagnet Clamping Shear Cartridge System for precise control
> Significantly improved workability with 350mm work fixture plate Cartridge replaceable tester suitable for repeated tests Multipurpose bond tester capable of handling up to 500Kgf load test Load fracture measurement precision, ± Achieved 0.15% GUI SW design maximizing user convenience, all-in-one test page Right Joystick button – Test Start key, Left Joystick button – XY stage speed variable, super high/low speed Test speed, shear test height , tool landing speed, overtravel, grade list & test conditions, etc. can be easily set in fine detail
Application of the latest Window-based GUI OS program technology
TCP/IP, SEC/GEM communication function installed as standard.
Test methods based on international semiconductor test regulations (JEDEC, MILS, EIA)