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Panel Level Packaging Panel FOUP / Panel FOUP
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF508
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：
● Capacity：8 PCS
● Glass size：510 x 515mm / 479 x 491mm，Thickness 0.5-2.0mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：25mm / 50mm -
Panel Level Packaging Panel FOUP / Panel FOUP 510×515 / 510 FOUP
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF516
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：≒25000g
● Capacity：16 PCS
● Glass size：510 x 515mm / 479 x 491mm，Thickness 0.4-3.2mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：20mm -
Panel Tray / Customized Panel Tray
● Product name：Panel Tray
● Part number：PA-T510510-E
● Dimension：
● Weight：
● Capacity：1 PCS
● Glass size：510 x 510 mm(Glass Panel or PCB)
● Material：Customized -
Panel Tray / Subtray Box
● Product name：Square Single Box
● Part number：GL-B510-PE
● Dimension：599(L)× 594(W)× 20(H) mm
● Weight：1475g
● Capacity：1 PCS
● Glass size：510 × 510 mm Square Subtray
● Material：Customized -
PCB FOUP / Panel FOUP 510×515 / Panel Level Packaging Panel FOUP
● Product name：PCB FOUP / Panel FOUP 510×515
● Part number：GL-PF524
● Dimension：620(L) x 633(W) x 750(H)mm
● Weight：<40000g ● Capacity：12 PCS ● Glass size：510 x 515mm，Thickness 0.4-3.2mm (Glass Panel or PCB) ● Material：Customized ● Slot pitch：27mm -
Polishing Wheel – DP
- Applying dry polishing after processing wafer with back grinding wheel.
- Mirror surface processing by using soft wool felt and ZrO2 250mm for improving roughness.
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Polishing Wheel-GDP
- Applying dry polishing after processing wafer with back grinding wheel.
- Improving roughness and realizing gathering effect by applying spherical silica.
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QFN Tape
QFN package tape / QFN Tape / Polyimide PI Tape / PCB Masking / QFN Back Tape / Kapton Tape / High Temperature / Molding tape
Application / Heat Press Tape / FPC TapeModel : KAL -
Sandwich Tape
Sandwich tape, Heat Resistance Tape
Double Sided Kapton (PI) tape / High Temperature ApplicationModel : SDK -
Silicone Molding Compound
SGC series
Shin-Etsu Chemical is offer silicone molding compound which can be thermosetting transfer molding system for electric and electronic parts. It is contained various fillers and additives based on silicone resin. It has excellent heat resistance, cold resistance and degradation resistance. It is shown stable electrical insulation performance because it is not changing properties by temperature and frequency. In addition, mold releasability is excellent.
Shin-Etsu responds to molding material that requires high heat resistance. -
Silicone Tape
Molding tape, Masking tape, Silicon tape, green tapeModel : GT -
Square Single Box / Subtray Box
● Product name：Square Single Box
● Part number：GL-B600-PS
● Dimension：800(L) × 800(W) × 70(H)mm
● Weight：
● Capacity：1 PCS
● Glass size：600 × 600 × 0.6~1.2 mm Square Subtray
● Material：Customized