Your Products
- No products in the cart.
₹0.00
-
510×515 FoPLP FOUP / Panel FOUP / Panel Level Packaging Panel FOUP
● Product name：Panel FOUP / FoPLP FOUP 510×515
● Part number：GL-PF500-S2
● Dimension：600(L) x 620(W) x 438(H)mm
● Weight：19000-22000g
● Capacity：16 PCS
● Glass size：510 x 515mm (Glass Panel or PCB)
● Material：Customized
● Slot pitch：20mm -
6 Inch Plastic Wafer Frames TJF-6P-2.5
Material: ABS
Dimensions: Width 211mm
Outer Diameter Ø226.7mm
Inside Diameter Ø195mmPlate Thickness: 2.5±0.15mm
-
6 Inch Wafer Frames TJF-6A
Material: SUS 420 stainless steelDimensions: Width 21.2 cm
Outer Diameter 22.8 cm
Inside Diameter 19.4 cmPlate Thickness: 1.2TSurface Treatment: Hair Line finish/Glossy finish -
7 inch SMT Reel Box / SMD Reel Box / ESD SMD Reel Storage Box
● Product name：SMT Reel Box / SMD Reel Box
● Part number：RE-B07
● Dimension：420(L) x 417(W) x 131(H)mm
● Weight：1650g
● Capacity：32 PCS
● Reel size：7 inch Reel
● Material：PC ESD -
8 Inch Plastic Wafer Frames TJF-8P-2.5
Material: PPS
Dimensions: Width 276mm
Outer Diameter Ø296mm
Inside Diameter Ø250mmPlate Thickness: 2.5±0.15mm
-
8 Inch Wafer Frames TJF-8B
Material: SUS 420 stainless steel
Dimensions: Width 27.6 cm
Outer Diameter 29.6 cm
Inside Diameter 25.0 cm
Plate Thickness: 1.2T
Surface Treatment: Hair Line finish/Glossy finish -
8″ Wafer Metal Frame Shipper
● Product name：8″ Wafer Metal Frame Shipper
● Part number：FR-S200-P
● Dimension：313(L) x 330(W) x 28.8(H)mm
● Weight：250g
● Capacity：1 PCS
● Frame size：8 inch Frame
● Material：PET -
Anti-static UV Release Tape
Anti-static UV release tape, UV dicing tapeModel : UAS -
Auot IC Tray Cassette / OHT IC Tray Cassette
● Product name：IC Tray Cassette (OHT)
● Part number：IC-TC35-O
● Dimension：339(L) x 180(W) x196(H)mm
● Weight：<2000g
● Capacity：20 set IC Tray
● Tray size：322.55(L) x 136(W) x 7.5(H)mm
● Material：Customized -
Back Grinding Wheel – Nano Pol
- Wafer surface roughness and die strength can be improved
- Grinding stress and wafer edge chipping can be reduced
- Diamond at the tip can be distributed consistently
- Porosity, pore shape and pore size control can be adjusted
- Possible to grind Si wafer up to 17㎛ (Ultra thin wafer)
- Outstanding grinding ability for TSV and normal(for finger print) compound wafer
-
Back Grinding Wheel – Resin
- Rough grinding (Z1)-(#325~600)
- Less edge chipping and grinding damage on thin wafer
- Excellent grinding ability without compromising wheel life time
- Fine grinding ( Z2 )-( #2000 ~ #4000 )
- Easy grinding with low and consistent grinding current
- Considerably longer life time than competitor’s
- #3000~#4000 : Superior surface roughness and minimized sawing mark
-
Back Grinding Wheel-Metal
- Leading technology in various types of machines and applications
- Rough wheel (Metal bond) : Long life time and excellent bulk removal rate
- Fine wheel (Vitrified bond) : Superior grinding ability and roughness
- Providing proper wheel designs for various grinding methods and proper recipes