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8″ Wafer Metal Frame Shipper
● Product name：8″ Wafer Metal Frame Shipper
● Part number：FR-S200-P
● Dimension：313(L) x 330(W) x 28.8(H)mm
● Weight：250g
● Capacity：1 PCS
● Frame size：8 inch Frame
● Material：PET -
Anti-static UV Release Tape
Anti-static UV release tape, UV dicing tapeModel : UAS -
Auot IC Tray Cassette / OHT IC Tray Cassette
● Product name：IC Tray Cassette (OHT)
● Part number：IC-TC35-O
● Dimension：339(L) x 180(W) x196(H)mm
● Weight：<2000g
● Capacity：20 set IC Tray
● Tray size：322.55(L) x 136(W) x 7.5(H)mm
● Material：Customized -
Back Grinding Wheel – Nano Pol
- Wafer surface roughness and die strength can be improved
- Grinding stress and wafer edge chipping can be reduced
- Diamond at the tip can be distributed consistently
- Porosity, pore shape and pore size control can be adjusted
- Possible to grind Si wafer up to 17㎛ (Ultra thin wafer)
- Outstanding grinding ability for TSV and normal(for finger print) compound wafer
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Back Grinding Wheel – Resin
- Rough grinding (Z1)-(#325~600)
- Less edge chipping and grinding damage on thin wafer
- Excellent grinding ability without compromising wheel life time
- Fine grinding ( Z2 )-( #2000 ~ #4000 )
- Easy grinding with low and consistent grinding current
- Considerably longer life time than competitor’s
- #3000~#4000 : Superior surface roughness and minimized sawing mark
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Back Grinding Wheel-Metal
- Leading technology in various types of machines and applications
- Rough wheel (Metal bond) : Long life time and excellent bulk removal rate
- Fine wheel (Vitrified bond) : Superior grinding ability and roughness
- Providing proper wheel designs for various grinding methods and proper recipes
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Boat Carrier / Boat Magazines / Magazine Cassette
● Product name：Magazine Cassette
● Part number：BO-MC10
● Dimension：317.5(L) x 168(W) x170(H)mm
● Weight：<3000g ● Capacity：10 set IC Boat -
De-Taping Tape
De taping tape, Peeling tape
Model : ETT / SAT -
Dicing Blade
- High accuracy, super thin blade developed by Shinhan Diamond
- Minimized chipping and superior consistence in quality through stringent particle
- Size distribution control
- Improve productivity by high feed speed
- Providing an optimized solution to the customers
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Double Side Thermal Release Tape
Thermal Release Double Side Tape, Transfer Tape
Model : SDF -
Double Side UV Release Tape
One side UV release adhesive, the other side with thermal release adhesive. Or double side UV release adhesive tape.Model : UDD / UTD -
Electroformed Micro Blade
- High accuracy
- Ultra-thin hub-less blade (~50um) vs Metal bond micro blade (>100um)
- Cutting any hard materials (ex Ceramic package, LTCC, HTCC)
- Advantages of cutting PKG with high abrasive content
- High yield long life time