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Multi-Purpose Single Cartridge Bond Test System
The next-generation bond tester HAWK-8200S model, which was created based on the field application technology of the 8000 Single bond tester for a long time, provides users with the best work convenience and efficiency, and realizes the best test quality with optimal user-friendly functions and ergonomic desktop equipment. did. Slim, ergonomic design through integrated development of one board control system
One touch position control microscope holder considering various workers
Various size stage options that can be converted by easy attachment/detachment, 50×50, 100×100, 200×200, customized type
High load , Electromagnet Clamping Shear Cartridge System for precise control
> Significantly improved workability with 350mm work fixture plate Cartridge replaceable tester suitable for repeated tests Multipurpose bond tester capable of handling up to 500Kgf load test Load fracture measurement precision, ± Achieved 0.15% GUI SW design maximizing user convenience, all-in-one test page Right Joystick button – Test Start key, Left Joystick button – XY stage speed variable, super high/low speed Test speed, shear test height , tool landing speed, overtravel, grade list & test conditions, etc. can be easily set in fine detail
Application of the latest Window-based GUI OS program technology
TCP/IP, SEC/GEM communication function installed as standard.
Test methods based on international semiconductor test regulations (JEDEC, MILS, EIA)
High Precision Micro-bump Bond Test System
The state-of-the-art wafer level bond tester, HAWK-8220WS, is a fully automatic wafer bond tester that can be easily in-lined with the India Handotai WH series, an automated wafer handler EFEM robot. Micro bump shear and CBP tests are performed by precisely handling 8-12” wafers, and sophisticated automatic bump shear tests are performed by loading wafer mapping files from the network. For small wafers under 8”, fully automatic wafer handling is possible by combining the bench top wafer loader IH WL200S
SMC series
SMC series are liquid epoxy encapsulation materials developed for potting materials, adhesives, and underfill materials for semiconductor devices.
The semiconductor device which is protected by this encapsulation material has excellent electrical properties and moisture resistance.
In addition, the low stress properties by using silicone which is Shin-Etsu Chemical’s original technology, shows excellent properties in heat resistance.
Synthetic Grinding Fluid
Application areas:
5-gallon pails | 55-gallon drums
SGC series
IH Chemical is offer silicone molding compound which can be thermosetting transfer molding system for electric and electronic parts. It is contained various fillers and additives based on silicone resin. It has excellent heat resistance, cold resistance and degradation resistance. It is shown stable electrical insulation performance because it is not changing properties by temperature and frequency. In addition, mold releasability is excellent.
Ih responds to molding material that requires high heat resistance.