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HAWK 8220WS
High Precision Micro-bump Bond Test System
The state-of-the-art wafer level bond tester, HAWK-8220WS, is a fully automatic wafer bond tester that can be easily in-lined with the India Handotai WH series, an automated wafer handler EFEM robot. Micro bump shear and CBP tests are performed by precisely handling 8-12” wafers, and sophisticated automatic bump shear tests are performed by loading wafer mapping files from the network. For small wafers under 8”, fully automatic wafer handling is possible by combining the bench top wafer loader IH WL200S
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Hoop Ring Cassette
● Product name：8″ Hoop Ring Cassette / Wafer Expander Ring Cassette / Grip Ring Cassette
● Part number：HR-C200
● Dimension：220.3(L) x 210.8(W) x 188.3(H)mm
● Weight：
● Apply for round wafer：6 inch (Ø150mm) wafer & 8 inch Expander Ring
● Material：PVC
● Slot Pitch：12mm -
Hoop Ring Shipper
● Product name：Hoop Ring Shipper
● Part number：HR-S150-P
● Dimension：234.51(L) x 234.51(W) x 6(H)mm
● Weight：168.80g
● Capacity：1 PCS
● Ring size：6″
● Material：PＥＴ -
Hoop Ring Shipper (5 inch Hoop Ring)
● Product name：Hoop Ring Shipper
● Part number：HR-S125-R
● Dimension：
TOP-138.4(L) x 138.4(W) x 16.5(H)mm
BTM-135.6(L) x 135.6(W) x 20.1(H)mm
● Capacity：1 PCS
● Ring size：5″
● Material：PET -
Hoop Ring Shipper (6 inch Hoop Ring)
● Product name：Hoop Ring Shipper
● Part number：HR-S150-R
● Dimension：
TOP-164.4(L) x 164.4(W) x 17.5(H)mm
BTM-161.5(L) x 161.5(W) x 20.1(H)mm
● Capacity：1 PCS
● Ring size：6″
● Material：PET -
Hoop Ring Shipper (6 inch Hoop Ring) 2
● Product name：Hoop Ring Shipper
● Part number：HR-S150-P
● Dimension：
● Capacity：1 PCS
● Ring size：6″
● Material：PET -
Hoop Ring Shipper (ESD)
● Product name：Hoop Ring Shipper(ESD)
● Part number：HR-S150-E
● Dimension：
● Weight：
● Capacity：1 PCS
● Apply for round wafer：6″
● Material：PS ESD -
IC Box
● Product name：IC Box
● Dimension：60.8(L) x 54(W) x 10.2(H)mm
● Capacity：Customized
● Material：PC ESD -
IC Tray Cassette / Jedec Tray Cassette
● Product name：IC Tray Cassette
● Part number：IC-TC35
● Dimension：339(L) x 180(W) x 196(H)mm
● Weight：1297.43g
● Capacity：20 set IC Tray
● Tray size：322.55(L) x 136(W) x 7.5(H)mm
● Material：Customized -
IC Tube Box / IC Packing Case
● Product name：IC Tube Box / IC Packing Case
● Dimension：Ø113 x 540 (H)mm
● Weight：300g
● Capacity：MAX53 PCS
● IC Tube size：IC Tube(18.5×6.5mm)
● Material：PP ESD、EPE ESD -
Liquid Epoxy Encapsulation Material
SMC series
SMC series are liquid epoxy encapsulation materials developed for potting materials, adhesives, and underfill materials for semiconductor devices.
The semiconductor device which is protected by this encapsulation material has excellent electrical properties and moisture resistance.
In addition, the low stress properties by using silicone which is Shin-Etsu Chemical’s original technology, shows excellent properties in heat resistance. -
Micro Blades-Metal
- High precision thin with superior cutting efficiency
- Maintains free cutting action at high RPM and fast feed rates
- Eliminate chipping during the sawing operation