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Edge Grinding Wheel
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Edge Grinding Wheel-Metal
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Electroplated CMP Pad Conditioner
- Mechanical Bonding (Ni plating)
- Excellent disk flatness : Superior wafer uniformity
- Clean disk surface : Near zero micro scratches.
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Entrepix Entegrity Polish Head Tester
Entrepix’ next-generation head tester puts the data in your hands to achieve less downtime and significant cost savings.
Entrepix designed this innovative, customer-favorite head tester through years of testing and troubleshooting. Now the head testing step transforms from a simple verification tool in the legacy version into a powerful troubleshooting platform. The new Entrepix head tester provides powerful troubleshooting capability that helps users dial in sensitive CMP processes while tracking each head via serial number. Our tester simulates wafer de-chuck and automatically checks the wafer present/absent sensor function, all while tracking test data for statistical process control.
Available in 6 zone for Titan I, Titan II (Profiler), and Contour polish heads
Available in 8 zone for Titan I, Titan II (Profiler), Contour and EVO polish heads.
Entrepix’ head tester allows real-time monitoring of “cross-talk” between head chambers and allows users to interrupt testing for faster chamber troubleshooting.
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Entrepix IPEC 472 Support
Entrepix offers upgrades, refurbishments, and spare parts for your IPEC 472 platforms.
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Equipment Upgrades
Entrepix’ OEM-level upgrades provide greater efficiency, accuracy, and reliability.
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Global Nanoscope
Above And Beyond metrology
Overview, insight and outlook In one process step: What was previously unthinkable in semiconductor manufacturing, the Global Nanoscope makes measurable. The entire surface of your wafer or any reflective surface is measured completely within just 30 seconds, providing reliable nanometer-scale insights that safeguard your process chain. Whether for incoming inspection in chip manufacturing or in process control during wafer fabrication: What was previously beyond the measurable, the Global Nanoscope makes visible.- Measures the entire surface up to 300 mm at once without stitching
- No moving parts during measurement
- Extremely high resolution in the nanometer scale
- The fastest complete surface measurement on the market
- Robust against floor vibration
- Innovative technology for all reflective surfaces
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HW1215
Highly-accurate high-speed machining with high workability and high wire speed
This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors
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HW810
Highly-accurate, high-speed slicing of hard materials up to 8 inches with ultra-high wire speed
This diamond wire saw has the industry’s fastest wire speed of 3,000 m/min, which significantly reduces processing time, warpage, and wire usage. It also supports 8-inch down-cutting, contributing to lower CoO.
Target workpieces: SiC, GaN, Sintered materials
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Insert Carriers
PR Hoffman is recognized as a leading innovator and manufacturer of Insert Carriers, also known as Polishing Carriers, for the semiconductor wafer industry. The insert carrier is an exclusive PR Hoffman design widely used in the semiconductor industry (and other high value wafer industries) to protect the edge profile of the wafer while providing the strength and durability of a traditional steel carrier.
Custom Designs for Semiconductor Processing
PR Hoffman generates a custom drawing for customer review and approval before any products are made. This added service ensures that our customers receive precisely the design needed for their process, on every order. -
Lapping, Polishing, and Grinding Carriers
We manufacture lapping carriers (also called workholders) for planetary lapping and polishing machines including those manufactured by P.R. Hoffman, Speedfam, Peter Wolters AG, Hamai, Somos, Fujikoshi, Strausbaugh, Melchiorre, Lanzhou, Lapmaster and other specialty machines adapted for unique applications. Lapping carriers are available in a variety of materials and thicknesses, including an inventory of more than 20 spring steel thicknesses.
We can create a custom drawing that you can review to ensure the design meets your exact specifications. If you have a drawing or sample part for a lapping or polishing process, PR Hoffman can provide a detailed quotation for your review.
PR Hoffman uses a wide variety of state of the art manufacturing methods to create your lapping carriers including, precision punching, Wire-EDM cutting, CNC machining, CNC routing, and laser cutting. With these options, nearly any lapping carrier configuration is available. We will recommend the most cost-effective method based on your machine and volume requirements.
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MERCURY 1000
Synthetic Grinding Fluid
Application areas:
5-gallon pails | 55-gallon drums