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6 Inch Wafer Frames TJF-6A
Material: SUS 420 stainless steelDimensions: Width 21.2 cm
Outer Diameter 22.8 cm
Inside Diameter 19.4 cmPlate Thickness: 1.2TSurface Treatment: Hair Line finish/Glossy finish -
8 Inch Plastic Wafer Frames TJF-8P-2.5
Material: PPS
Dimensions: Width 276mm
Outer Diameter Ø296mm
Inside Diameter Ø250mmPlate Thickness: 2.5±0.15mm
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8 Inch Wafer Frames TJF-8B
Material: SUS 420 stainless steel
Dimensions: Width 27.6 cm
Outer Diameter 29.6 cm
Inside Diameter 25.0 cm
Plate Thickness: 1.2T
Surface Treatment: Hair Line finish/Glossy finish -
8″ Wafer Metal Frame Shipper
● Product name：8″ Wafer Metal Frame Shipper
● Part number：FR-S200-P
● Dimension：313(L) x 330(W) x 28.8(H)mm
● Weight：250g
● Capacity：1 PCS
● Frame size：8 inch Frame
● Material：PET -
Back Grinding Wheel-Metal
- Leading technology in various types of machines and applications
- Rough wheel (Metal bond) : Long life time and excellent bulk removal rate
- Fine wheel (Vitrified bond) : Superior grinding ability and roughness
- Providing proper wheel designs for various grinding methods and proper recipes
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Belt Sorters
Customization Made Easy
Whether for incoming and outgoing inspection, quality control in the production process: safety and reliability are always the focus of our modular belt sorter systems. The modules enable specific sorting and measurements with our well proven MX systems, belt transport, receiving stations with wafer switches and much more. More than 35 years of development ensure smooth integration into your production chain – exactly as your process requires.
- Convenient measuring systems for all common wafer characteristics
- Flexible integration of MX 202 modules and individual components
- Long lifetime & low maintenance
- Extremely short production time, individual support
- Many different wafer types and sizes
- Speed: up to 1000 wafers per hour
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Customized Disco Wafer Frame TJF-C-3
Material: SUS 420 stainless steel
Surface Treatment: Hair Line finish/Glossy finish -
DW160S
Easy-to-use compact single wire saw
This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
It is compact and easy to operate. (Maximum workpiece size: 8 inches)
Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide -
DW340S
Single wire saw capable of cutting long workpieces
This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
An optional goniometer stage and Y-axis table for back and forth functions are available.
(Maximum workpiece size: 13 inches)
Target workpieces: Silicon, quartz, fluorite, tungsten carbide -
Edge Grinding Wheel
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Edge Grinding Wheel-Metal
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Film Frame FOUP (Dicing) / Tape Frame FOUP Plus
● Product name：Frame FOUP Plus
● Part number：CKF300 Plus
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD