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MX 1018
Application
High-resolution thickness and flatness (TTV) gauge for 300–450mm silicon wafers.Easy adaptation to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX1018 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV).
A pair of capacitive sensors samples four radial profiles (45 degrees) on each wafer which consist of hundreds of local thickness values. If necessary for your application, the four standard scans can be simply increased to achieve an even higher measuring coverage. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 102-6
Application
High-resolution thickness and flatness (TTV) gauge for 100–150mm silicon wafers.Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX102-6 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV). A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer.
One such profile consists of 200 local thickness values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 102-8
Application
High-resolution thickness and flatness (TTV) gauge for 150–200mm silicon wafersEasy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX102-8 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV).
A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer. One such profile consists of 200 local thickness
values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 2012
Application
High precision chip production geometry gauge for 300mm silicon wafers.The MX2012 works as manually loaded stand-alone station with a throughput of at least 50 wafers per hour. With its 69 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Upright position measuring avoids gravity-induced sag. System can be converted for 200mm wafer measuring. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 2012-H
Application
Fast chip production geometry gauge for 300mm silicon wafers.The MX2012-H works as manually loaded stand-alone station with a throughput of at least 50 wafers per hour. With its 69 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. System can be converted for 200mm wafer measuring. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 2013
Application
Automatable geometry gauge for thin and standard 200mm or 300mm silicon wafers.The MX2013 works as semi-automated stand-alone station. With its 37 measuring points it gauges 300mm wafers within 50 seconds. It controls thickness, bow and warp in high resolution (Corresponds with Sori). System optional available for 200mm wafer measuring. Comes with our powerful MX-NT operating Software.
Measurement type
Thickness | Flatness (TTV) -
MX 2018-W
Application
Automatable bow and warp gauge for 450mm silicon wafers.The MX2018-W manages the difficult 450mm size wafers. Upright position measuring avoids the otherwise enormous gravity-induced sag. With its 73 measuring points it controls center thickness, bow and warp in high resolution. For covering all geometry properies we recommend using MX2018-W in combination with MX1018. Within a robot sorter these both modules can measure two wafers simultaneously without detraction of the throughput. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 203-4-21
Application
Fast contactless geometry gauge for 2–4″ silicon wafers.High throughput: the MX203-4-21 gauges with its 21 measuring points every wafer within max. 5 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp -
MX 203-4-37-Q
Application
Fast contactless geometry gauge for 2–4″ non-conductive and semi-insulating wafers.High throughput: the MX203-4-37-Q gauges with its 37 measuring points every wafer within max. 10 seconds. It controls thickness and flatness. Flexible wafer size adjustment by various centering-frames. Suitable for wafers made of non-conductive substrates (Quartz, Saphire, Lithium Niobate, Lithium Tantalate) and semi-insulating materials like Gallium Arsenide or Silicon Carbide. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) -
MX 203-58-37-B
Application
Fast contactless geometry gauge for thin 125– 200mm silicon wafers.High throughput: the MX203-58-37-B gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp -
MX 203-6-33
Application
Fast contactless geometry gauge for 100–150mm silicon wafers.High throughput: the MX203-6-33 gauges with its 33 measuring points every wafer within max. 7 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp -
MX 203-6-33-B
Application
Fast contactless geometry gauge for thin 100–150mm silicon wafers.High throughput: the MX203-6-33-B gauges with its 33 measuring points every wafer within max. 7 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp