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MX 604-S
Application
Fast sheet resistance gauge for 50–200mm silicon wafers and conductive films.The MX604-S gauges sheet resistance of semiconducting wafers and conductive films on high-ohm substrates with the reliable eddy current method. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Sheet resistance -
MX 604-ST
Application
Combined thickness and resistivity gauge for up to 156mm solar wafersThe MX604-ST is designed to characterize solar wafers. Fits square wafers up to 156mm and round wafers from 2″ to 200mm. It combines sensors for measuring thickness and resistivity simultaneously. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Resistivity -
MX 608
Application
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 7012
Application
High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.The MX7012 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
MX 7018
Application
The MX7018 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
Robot Sorters
- Customization high-end
Your requirements – your tool. Our Robot Sorters are designed as a completely modular principle: individual inline measurements with our field-proven MX systems, fully automatic robotic sorting, aligner and carrier stations, tracks, cassette stations and many more. ore than 250 of these individual robot sorters have been developed for our customers and integrated into the process chain. Safety, repeatability and extremely low maintenance times are always our top priorities. And all this with an extraordinary throughput. - All measurements and requirements in one system for up to 200 WPH
- Flexible integration of the required components
- Long lifetime & low maintenance
- Extremely short production time, individual support
- Almost all types of wafers: 150-200 mm, 300 mm, Taiko etc.
- International calibration standards, SEMI standards
- Customization high-end
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Square Wafer Frame TJF-C
Material: SUS 420 stainless steel
Surface Treatment: Hair Line finish/Glossy finish -
SW1215
Compact wire saw with easy change-over, suitable for high-mix low-volume production
This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.
Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets -
SW1730D
Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed
This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.
Target workpieces: SiC, GaN, Sintered materials, Sapphire -
SW2230D
Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches
Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.
Target workpieces: SiC, GaN, Sintered materials, Sapphire -
SW3020
Wire saw for highly-accurate slicing required in high precision crystal materials
This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.
Target workpieces: Crystal, LT/LN, Sintered materials -
SW630D
Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach
6 inch down-cut machine with the minimum wire slack made possible by using the industry’s narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.
Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials