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SW1215
Compact wire saw with easy change-over, suitable for high-mix low-volume production
This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets
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SW1730D
Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed
This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.Target workpieces: SiC, GaN, Sintered materials, Sapphire
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SW2230D
Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches
Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.Target workpieces: SiC, GaN, Sintered materials, Sapphire
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SW3020
Wire saw for highly-accurate slicing required in high precision crystal materials
This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.Target workpieces: Crystal, LT/LN, Sintered materials
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SW630D
Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach
6 inch down-cut machine with the minimum wire slack made possible by using the industry’s narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials
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SW830D
Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut
Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets
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TENSOR HTD Series
Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives
Application areas:
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The New Entrepix DSS-200
The new generation OnTrak system is here, directly from the OEM
The modernized Entrepix DSS-200 double-sided post-CMP wafer cleaner offers the same familiar functionality as the legacy OnTrak system with numerous upgrades for today’s cleaning process demands.As the OEM for OnTrak systems, Entrepix has engineered the NEW DSS-200 OnTrak for reliability and longevity with support and spares you can depend on.
Our DSS-200 cleaners offer:
- Parts exchangeability with legacy OnTrak systems
- Replacement and modernization of obsolete parts
- Configuration for 100-200mm substrate
- Accommodation for smaller wafers with custom-designed carriers
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UD150
Compact wire saw capable of highly accurate dicing with high workability
This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.
Target workpieces: Crystal, pipe materials, Rare-earth materials -
VECTOR HTG
Synthetic Grinding Fluids
Application areas:
5-gallon pails | 55-gallon drums -
VECTOR HTI-1.1
Synthetic Cooolant/Lubricant for Silicon Cropping, Sawing, and Edge-Grinding in Non-Recirculating Applications
VECTOR HTI-1.1 is a synthetic formulation developed for use in “once-through” processes using diamond blades or diamond wires.
Application areas:
5-gallon pails | 55-gallon drums
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VECTOR HTS Series
Vector HTS Series Products are biodegradable, viscous, polymer/surfactant mixtures formulated to be used with Aluminum Oxide (either PWA type or FO Type) and de-ionized water to form a suspension-type lapping slurry.
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
5-gallon pails | 55-gallon drums