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SW2230D
Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches
Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.Target workpieces: SiC, GaN, Sintered materials, Sapphire
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SW3020
Wire saw for highly-accurate slicing required in high precision crystal materials
This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.Target workpieces: Crystal, LT/LN, Sintered materials
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SW630D
Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach
6 inch down-cut machine with the minimum wire slack made possible by using the industry’s narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials
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SW830D
Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut
Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets
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UD150
Compact wire saw capable of highly accurate dicing with high workability
This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.
Target workpieces: Crystal, pipe materials, Rare-earth materials -
Wafer Tweezers in High Yech Polymers TJM-1
Material: Stainless Steel Antimagnetic SA
Dimensions: L 126mm
W 9mm
H 1.5mm
Tips thickness 0.5mm
Tips width 0.5mmNet Weight: 14g
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Wafer Tweezers in High Yech Polymers TJM-4
Material: Stainless Steel Antimagnetic SA
Dimensions: L 138 mm
W 10 mm
H 1.5 mm
Tips thickness 13 mm
Tips width 21 mmNet Weight: 17g
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Wafer Tweezers in High Yech Polymers TJM-8
Material: Stainless Steel Antimagnetic SA
Dimensions: L 136 mm
W 10 mm
H 1.5 mm
Tips thickness 0.8 mm
Tips width 27 mm
Tips length 21mmNet Weight: 19g
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YPI – 500
YPI – 500 – Inspection system for large glass substrate
Can inspect surface particles for large size glass substrate and film sheet.
Apply to warpage for sample center position with auto focus sensor unit. -
YPI – MN
Compact・High performance Wafer surface inspection system
New designed compact and high performance of wafer surface inspection system is reduced 50% to its footprint compared with previous same kind of product. Despite compact body, the maximum sensitivity is 0.15um on bare silicon, and then it can be easy to move to your designated location with desk.
Can choose the surface isolated function (The function can measure a surface of the transparent wafer without receiving contaminations of a back wafer.) as optional for transparent substrate and wafer. Output is map, histogram, which are saved and displayed to an attached PC. -
YPI – N series (Automated transfer)
Wafer surface inspection system YPI-N series（Auto loading）
Can scan particles on mirror wafer (silicon wafer) with fast.
Wide range measurement from small size wafer (2/3inch) to 8inch wafer. -
YPI – N Series (Manual)
YPI – N – XY/YPI – N – Θ
Wafer surface inspection system YPI-N series（Manual）
Can scan particles on mirror wafer (silicon wafer) with fast.
Wide range measurement from small size wafer (2/3inch) to 8inch wafer.