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SW830D
Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut
Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.
Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets -
UD150
Compact wire saw capable of highly accurate dicing with high workability
This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.
Target workpieces: Crystal, pipe materials, Rare-earth materials -
Wafer Tweezers in High Yech Polymers TJM-1
Material: Stainless Steel Antimagnetic SA
Dimensions: L 126mm
W 9mm
H 1.5mm
Tips thickness 0.5mm
Tips width 0.5mmNet Weight: 14g
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Wafer Tweezers in High Yech Polymers TJM-4
Material: Stainless Steel Antimagnetic SA
Dimensions: L 138 mm
W 10 mm
H 1.5 mm
Tips thickness 13 mm
Tips width 21 mmNet Weight: 17g
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Wafer Tweezers in High Yech Polymers TJM-8
Material: Stainless Steel Antimagnetic SA
Dimensions: L 136 mm
W 10 mm
H 1.5 mm
Tips thickness 0.8 mm
Tips width 27 mm
Tips length 21mmNet Weight: 19g
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YPI – 500
YPI – 500 – Inspection system for large glass substrate
Can inspect surface particles for large size glass substrate and film sheet.
Apply to warpage for sample center position with auto focus sensor unit. -
YPI – MN
Compact・High performance Wafer surface inspection system
New designed compact and high performance of wafer surface inspection system is reduced 50% to its footprint compared with previous same kind of product. Despite compact body, the maximum sensitivity is 0.15um on bare silicon, and then it can be easy to move to your designated location with desk.
Can choose the surface isolated function (The function can measure a surface of the transparent wafer without receiving contaminations of a back wafer.) as optional for transparent substrate and wafer. Output is map, histogram, which are saved and displayed to an attached PC. -
YPI – N series (Automated transfer)
Wafer surface inspection system YPI-N series（Auto loading）
Can scan particles on mirror wafer (silicon wafer) with fast.
Wide range measurement from small size wafer (2/3inch) to 8inch wafer. -
YPI – N Series (Manual)
YPI – N – XY/YPI – N – Θ
Wafer surface inspection system YPI-N series（Manual）
Can scan particles on mirror wafer (silicon wafer) with fast.
Wide range measurement from small size wafer (2/3inch) to 8inch wafer. -
YPI 200F Inspection system for film sheet
Inspection system for film sheet which can be applied to roll to roll.
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YPI-MX Series (Automated Transfer)
ＹＰＩ－ＭＸ－ＸＹＡ／ＹＰＩ－ＭＸ－ΘＡ
Glass substrate/ Sapphire wafer surface inspection system.
YPI-MX series（Auto loading type）
Specialized to tune for a transparent substrate. Apply to measure a rough polishing of back of substrate. -
YPI-MX Series (Manual)
YPI-MX-XY/YPI-MX-Θ
Glass substrate/ Sapphire wafer surface inspection system
YPI-MX series（Manual）
Specialized to tune for a transparent substrate. Apply to measure a rough polishing of back of substrate.