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FOSB (300mm / 12 inch)
● Product name：FOSB
● Part number：SH-B300
● Dimension：389(L) x 340(W) x 331(H)mm
● Capacity：25 PCS
● Apply for round wafer：300mm(12 inch)Wafer
● Material：Customized -
Frame Airtight Cassette / Wafer Frame Cassette
● Product name：12″ Frame Airtight Cassette
● Part number：FR-C300-A
● Dimension：396.1(L) x 394.0(W) x 188.5(H)mm
● Weight：3300g
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm)
● Material：PC ESD -
Frame Airtight Cassette / Wafer Frame Cassette
● Product name：8″ Frame Airtight Cassette
● Part number：FR-C200-A
● Dimension：301(L) x 288(W) x 206.3(H)mm
● Weight：2700g
● Capacity：25 PCS
● Apply for round wafer：8 inch (Ø200mm)
● Material：PC ESD -
Frame FOUP
● Product name：Frame FOUP
● Part number：CKF300
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC+CN -
Frame FOUP Adapter / Tape Frame FOUP 200mm
● Product name：Frame FOUP
● Part number：CKF200
● Dimension：387.0(L) x 392.0(W) x 196(H)mm
● Capacity：13 PCS
● Apply for round wafer：8 inch (Ø200mm) Wafer
● Material：PC ESD -
Frame FOUP ADV / Tape Frame FOUP ADV / FOUP ADV
● Product name：Frame FOUP Plus
● Part number：CKF300 ADV
● Dimension：387.0(L) x 392.0(W) x 206(H)mm
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD -
Frame Light Cassette / Wafer Frame Cassette
● Product name：12″ Frame Light Cassette
● Part number：FR-C300-L
● Dimension：414.0(L) x 394.0(W) x 188.5(H)mm
● Weight：3640g
● Capacity：13 PCS
● Apply for round wafer：12 inch (Ø300mm) Wafer
● Material：PC ESD -
Global Nanoscope
Above And Beyond metrology
Overview, insight and outlook In one process step: What was previously unthinkable in semiconductor manufacturing, the Global Nanoscope makes measurable. The entire surface of your wafer or any reflective surface is measured completely within just 30 seconds, providing reliable nanometer-scale insights that safeguard your process chain. Whether for incoming inspection in chip manufacturing or in process control during wafer fabrication: What was previously beyond the measurable, the Global Nanoscope makes visible.- Measures the entire surface up to 300 mm at once without stitching
- No moving parts during measurement
- Extremely high resolution in the nanometer scale
- The fastest complete surface measurement on the market
- Robust against floor vibration
- Innovative technology for all reflective surfaces
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Grooved Wafer Frame TJF-C-2
Material: SUS 420 stainless steel
Surface Treatment: Hair Line finish/Glossy finish -
HW1215
Highly-accurate high-speed machining with high workability and high wire speed
This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.
Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors -
HW810
Highly-accurate, high-speed slicing of hard materials up to 8 inches with ultra-high wire speed
This diamond wire saw has the industry’s fastest wire speed of 3,000 m/min, which significantly reduces processing time, warpage, and wire usage. It also supports 8-inch down-cutting, contributing to lower CoO.
Target workpieces: SiC, GaN, Sintered materials -
MX 1012
Application
High-resolution thickness and flatness (TTV) gauge for 200–300mm silicon wafers.
Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX1012 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV) especially after grinding and lapping. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer which consist of hundreds of local thickness values. If necessary for your application, the four standard scans can be simply increased to reach an even higher measuring coverage. Comes with our powerful MX-NT operating software.
Measurement typeThickness | Flatness (TTV)