12 Inch Plastic Wafer Frames TJF-12P-2.5

Material: ABS
Dimensions: Width 380mm
Outer Diameter Ø400mm
Inside Diameter Ø350mm
Plate Thickness: 2.5±0.15mm

12 Inch Plastic Wafer Frames TJF-12P-2.5

  1. Plastic Wafer Frame/ Plastic Dicing Ring/ Tape Frame
  2. Made of ABS
  3. The product is lightweight and durable.
  4. Suitable for semiconductor industry, wafer, electronics industry, clean room
  5. We provide customized services for stainless steel wafer frame, and the size can be adjusted according to your needs.

Engineered for modern semiconductor production, the TJF-12P-2.5 plastic wafer frame delivers the perfect balance of precision, durability, and cleanliness. Designed by india handotai, it provides reliable support for 12-inch wafers during dicing, cleaning, and packaging processes. Each frame is crafted from high-quality materials to ensure stability under demanding cleanroom environments, making it a trusted choice for advanced wafer processing.

We also offer custom stainless-steel wafer rings in 6-inch, 8-inch, and 12-inch options. Choose from polished or matte finishes, add engraved markings, or request bespoke designs tailored to your production requirements — all backed by our precision engineering and manufacturing expertise.

Our cooperation customers: Amkor、ASE、KLA、TSMC、ABB.

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