Application
High-resolution thickness and flatness (TTV) gauge for 200–300mm silicon wafers.
Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX1012 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV) especially after grinding and lapping. A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer which consist of hundreds of local thickness values. If necessary for your application, the four standard scans can be simply increased to reach an even higher measuring coverage. Comes with our powerful MX-NT operating software.

Measurement type

Thickness | Flatness (TTV)

Application
High-resolution thickness and flatness (TTV) gauge for 150–200mm silicon wafers

Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX102-8 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV).
A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer. One such profile consists of 200 local thickness
values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
High precision chip production geometry gauge for 300mm silicon wafers.

The MX2012 works as manually loaded stand-alone station with a throughput of at least 50 wafers per hour. With its 69 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Upright position measuring avoids gravity-induced sag. System can be converted for 200mm wafer measuring. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
Automatable bow and warp gauge for 450mm silicon wafers.

The MX2018-W manages the difficult 450mm size wafers. Upright position measuring avoids the otherwise enormous gravity-induced sag. With its 73 measuring points it controls center thickness, bow and warp in high resolution. For covering all geometry properies we recommend using MX2018-W in combination with MX1018. Within a robot sorter these both modules can measure two wafers simultaneously without detraction of the throughput. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
Fast contactless geometry gauge for 2–4″ silicon wafers.

High throughput: the MX203-4-21 gauges with its 21 measuring points every wafer within max. 5 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV) | Bow | Warp

Application
Fast contactless geometry gauge for 100–150mm silicon wafers.

High throughput: the MX203-6-33 gauges with its 33 measuring points every wafer within max. 7 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV) | Bow | Warp

Application
Fast contactless geometry gauge for thin 100–150mm silicon wafers.

High throughput: the MX203-6-33-B gauges with its 33 measuring points every wafer within max. 7 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV) | Bow | Warp

Application
Fast contactless geometry gauge for 150mm and 200mm silicon wafers.

High throughput: the MX203-6-33 gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software

Measurement type
Thickness | Flatness (TTV) | Bow | Warp

Application
Fast contactless geometry gauge for thin 150mm and 200mm silicon wafers.

High throughput: the MX203-8-37-B gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MXNT operating software.

Measurement type
Thickness | Flatness (TTV) | Bow | Warp

Application
Automatable geometry gauge for thin 100–150mm silicon wafers.

The MX204-6-13-V works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 13 measuring points it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
The MX204-6-33 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 33 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
Automatable geometry gauge for 150mm and 200mm silicon wafers.

The MX204-8-37 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 37 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
Automatable geometry gauge for 125–156mm solar wafers.

The MX204-8-49-q works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 49 measuring points it controls thickness, bow and warp in high resolution. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV) | Bow | Warp | sori

Application
Easy one-point thickness gauge for 30–200mm semiconducting and metallic materials.

The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display.Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness

Application
Easy one-point thickness gauge for 30–200mm non-conductive wafers.

The MX301-Q is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of wafers consisting of insulating materials like quartz, sapphire or glass. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness

Application
Easy one-point thickness gauge for thin, framed 200mm and 300mm silicon wafers.

The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge. Especially for thin wafers, unframed and framed with dicing tape or backgrind tape. Simple handling without the tape thickness nor the tape’s dielectric constant. Light barriers avoid mismeasurement at the edges. Fully self-calibrating without the need for gauge blocks nor reference wafers. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness

Application
The MX 302 measures a high resulution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.

Measurement type
Thickness

Application
Fast contactless resistivity gauge for silicon blocks.

The MX604 gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4
different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface. Our optional software EHMaster allows further evaluation of the measurements and configuration
of the tool.

Measurement type
Thickness

Application
Portable contactless resistivity gauge for silicon blocks.

The MX604-B gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4 different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Powered by rechargable battery. With energy-saving automatic stand-by mode. Intended as portable stand-alone version of MX604.

Measurement type
Thickness

Application
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.

The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.

Measurement type
Thickness

Application
High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.

The MX7012 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.

Measurement type
Thickness