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Rotating Multi-Cartridge Bond Tester
It is a multi-purpose automatic bond test system that can perform various tests simultaneously by installing up to 4 different load cartridges and automatically replacing cartridges within 3 seconds by clicking the program button.
Automatic replacement of Max 4 cartridges within 3 seconds Individual load module installed, if one cartridge is defective, the other load module operates normally Suitable for simultaneous multi-bond test Multipurpose bond tester capable of testing a maximum load of 100Kgf Test precision: < ± 0.15% GUI SW design maximizing user convenience, all-in-one test page Right Joystick button – Test Start key, Left Joystick button – XY stage speed variable, ultra high / ultra low speed Test speed, shear test height, tool landing speed, overtravel, grade list & test conditions can be easily set in fine detail Application of the latest Window- based GUI OS program technology TCP /IP, SEC/GEM communication functions are installed as standard Test methods based on international semiconductor test regulations (JEDEC, MILS, EIA)
Multi-Purpose Single Cartridge Bond Test System
The next-generation bond tester HAWK-8200S model, which was created based on the field application technology of the 8000 Single bond tester for a long time, provides users with the best work convenience and efficiency, and realizes the best test quality with optimal user-friendly functions and ergonomic desktop equipment. did. Slim, ergonomic design through integrated development of one board control system
One touch position control microscope holder considering various workers
Various size stage options that can be converted by easy attachment/detachment, 50×50, 100×100, 200×200, customized type
High load , Electromagnet Clamping Shear Cartridge System for precise control
> Significantly improved workability with 350mm work fixture plate Cartridge replaceable tester suitable for repeated tests Multipurpose bond tester capable of handling up to 500Kgf load test Load fracture measurement precision, ± Achieved 0.15% GUI SW design maximizing user convenience, all-in-one test page Right Joystick button – Test Start key, Left Joystick button – XY stage speed variable, super high/low speed Test speed, shear test height , tool landing speed, overtravel, grade list & test conditions, etc. can be easily set in fine detail
Application of the latest Window-based GUI OS program technology
TCP/IP, SEC/GEM communication function installed as standard.
Test methods based on international semiconductor test regulations (JEDEC, MILS, EIA)
High Precision Micro-bump Bond Test System
The state-of-the-art wafer level bond tester, HAWK-8220WS, is a fully automatic wafer bond tester that can be easily in-lined with the India Handotai WH series, an automated wafer handler EFEM robot. Micro bump shear and CBP tests are performed by precisely handling 8-12” wafers, and sophisticated automatic bump shear tests are performed by loading wafer mapping files from the network. For small wafers under 8”, fully automatic wafer handling is possible by combining the bench top wafer loader IH WL200S
– Ball(Die) shear tool for Dage, Royce, XYZ tech (Size : 1mil ~ 35mils)
– Wire pull test hook (Size : 1mil ~ 35mil)
DST/BST/WPT