Your Products
- No products in the cart.
₹0.00
-
CVD CMP Pad Conditioner
- Various patterns can be arranged CVD diamond coated tips
- Apex of the CVD diamond coated tip is flat face
- Allows to engineer the critical pressure applied to each tip for pad conditioning
- EHWA has a patents on the tip size and number for pad conditioning
- The apex where contacts the pad has not changed over the conditioning time
- Pad cut rate is constant
-
Electroplated CMP Pad Conditioner
- Mechanical Bonding (Ni plating)
- Excellent disk flatness : Superior wafer uniformity
- Clean disk surface : Near zero micro scratches.
-
New BSL CMP Pad Conditioner
- Strong diamond holding force : Chemical reaction + Mechanical contact
- Corrosion resistance : Carbide interface between diamond & bond material
- Longer lifetime : Utilization of edges by diamond face
- Maximized diamond chip pocket by high diamond exposure
- Excellent conditioning efficiency and pad debris removal rate