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YPI-MX Series (Manual)
YPI-MX-XY/YPI-MX-Θ
Glass substrate/ Sapphire wafer surface inspection system
YPI-MX series（Manual）
Specialized to tune for a transparent substrate. Apply to measure a rough polishing of back of substrate. -
YPI-MX-ODC
New designed detection units which are cross setting with dual 355nm (UV) laser.
The dual detector contributes enhanced detection for a slight scratch generated directional light scattered compared with conventional particle inspection system.
And also, 355nm laser is effective for isolated detection of SiC surface only.
Inspection time is within 5min for 4inch SiC wafer. -
FOUP (200mm / 8 inch)
● Product name：FOUP
● Part number：CK213
● Dimension：252.5(L) x 224.2(W) x 213(H)mm
● Weight：2930g
● Capacity：13 pcs
● Apply for round wafer：200mm(8 inch)Wafer
● Material：Customized -
FOUP Adapter
● Product name：FOUP Adapter
● Part number：AD-F200
● Dimension：440(L) x 347(W) x 337(H)mm
● Weight：
● FOUP size：300mm(12 inch) FOUP
● Material：Customized -
Teflon Cassette / PFA Cassette (200mm / 8 inch)(High Profile)
● Product name：8″ Teflon Cassette / PFA Cassette
● Part number：PF-C200
● Dimension：203.2(L) x 233.05(W) x 218.44(H)mm
● Weight：1407g
● Capacity：25 PCS
● Apply for round wafer：8 inch (Ø200mm)
● Material：Teflon / PFA
● Slot Pitch：6.35mm -
Wafer SMIF Pod – 200mm (8 inch)
● Product name：Wafer SMIF Pod
● Part number：WSP200
● Dimension：292.2(L) x 282.8(W) x 253.6(H)mm
● Weight：2600g
● Capacity：1 Set 8”Wafer Cassette
● Apply for round wafer：200mm(8 inch)
● Material：PC/PC ESD