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CVD CMP Pad Conditioner
- Various patterns can be arranged CVD diamond coated tips
- Apex of the CVD diamond coated tip is flat face
- Allows to engineer the critical pressure applied to each tip for pad conditioning
- EHWA has a patents on the tip size and number for pad conditioning
- The apex where contacts the pad has not changed over the conditioning time
- Pad cut rate is constant
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Electroplated CMP Pad Conditioner
- Mechanical Bonding (Ni plating)
- Excellent disk flatness : Superior wafer uniformity
- Clean disk surface : Near zero micro scratches.
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Entrepix Entegrity Polish Head Tester
Entrepix’ next-generation head tester puts the data in your hands to achieve less downtime and significant cost savings.
Entrepix designed this innovative, customer-favorite head tester through years of testing and troubleshooting. Now the head testing step transforms from a simple verification tool in the legacy version into a powerful troubleshooting platform. The new Entrepix head tester provides powerful troubleshooting capability that helps users dial in sensitive CMP processes while tracking each head via serial number. Our tester simulates wafer de-chuck and automatically checks the wafer present/absent sensor function, all while tracking test data for statistical process control.
Available in 6 zone for Titan I, Titan II (Profiler), and Contour polish heads
Available in 8 zone for Titan I, Titan II (Profiler), Contour and EVO polish heads.
Entrepix’ head tester allows real-time monitoring of “cross-talk” between head chambers and allows users to interrupt testing for faster chamber troubleshooting.
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Entrepix IPEC 472 Support
Entrepix offers upgrades, refurbishments, and spare parts for your IPEC 472 platforms.
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Equipment Upgrades
Entrepix’ OEM-level upgrades provide greater efficiency, accuracy, and reliability.
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FILCON ® FTIR-SE BP Concentration Measurement FTIR – Spectroscopic Ellipsometer (Infrared Spectroscopic Ellipsometer)
Spectroscopic ellipsometers can be configured to cover a wide wavelength range from DUV to NIR. The DUV range is useful for measuring ultra-thin films, such as in the nanometer thickness range. The deep UV range is also essential if you need to measure the band gap of a material or the measurement of native oxides on silicon wafers with a thickness of about 1 to 2 nm, while the visible or near-infrared range is used for measurements of relatively thick or very thick thin film coatings.
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FILCON ® SE-DUV-VIS-NIR Ellipsometer (Spectroscopic Ellipsometer)
Spectroscopic ellipsometers can be configured to cover a wide wavelength range from DUV to NIR. The DUV range is useful for measuring ultra-thin films, such as in the nanometer thickness range. The deep UV range is also essential if you need to measure the band gap of a material or the measurement of native oxides on silicon wafers with a thickness of about 1 to 2 nm, while the visible or near-infrared range is used for measurements of relatively thick or very thick thin film coatings.
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FILCON ® SR · SE Combo Spectroscopic Reflectometer
SR · SE is a Combo Metrology that integrates a reflectometer and an ellipsometer into one device.
It is a hybrid thin-film measuring device that maximizes measurement ability and utilization to enable high-level research and development purposes and simple repetitive measurement work by combining the advantages of reflectometer and ellipsometer. In order to supplement the measurement accuracy of SR (Reflectometer), which is generally less reliable in measuring thin films of several nanometers or less, a separate SE (Ellipsometer) is used for Å level thickness measurement, material-specific optical constants (n, k) measurement, and material characterization. measured using it. FILCON SR · SE is a cost-effective and powerful multi-purpose thin film measurement instrument that integrates SE’s unique precision measurement and analysis capabilities and SR’s ease of use into one instrument .
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FILCON ® SR FAB Fully Automatic Mapping Spectroscopic Reflectometer
FILCON SR-FAB is a full-automatic spectroscopic reflectance measurement equipment for semiconductor clean rooms that can automatically measure the thickness (t), reflectance, and transmittance of transparent thin films of several nanometers to several tens of mm by calling a pre-written mapping recipe from upper host communication. is. It meets the optimal automated metrology measurement requirements for in-line remote measurement with various options that enable micro-area target measurement of pattern wafers. It is possible to configure a unique low-cost system in the form of fully automated all-in-one metrology optimized for small wafers under 8” and various customized in-situ automated metrology equipment based on EFEM consisting of SMIF, multiple load ports and state-of-the-art transfer robots.
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FILCON® SR 300S Mapping Spectroscopic Reflectometer
FILCON SR-300S is a micron-level precision XY stage and granite plate that can automatically measure the thickness (t), reflectance, and transmittance of transparent thin films of several nanometers to several tens of mm with a pre-written mapping measurement recipe using vertically incident light. It is a stand-alone automatic non-contact spectroscopic reflection measurement equipment with a rigid structure based metrology frame. It is equipped with advanced spectroscopic measurement options such as auto-focus and vision PRS pattern matching for precise measurement of micro-regions of wafer patterns, enabling precise measurement .
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FILCON® SR Mini Mini Spectroscopic Reflectometer
Cost-effective all-in-one SR measurement equipment for research and development ·
of thickness, reflectance and transmittance of thin filmsMeasure the measurement area while watching the live camera image.
Nano-level thin film thickness measurement and image XY dimension measurement are possible.
Provides powerful measurement function in a compact equipment configuration.
Simple and easy Windows GUI measurement program -
Glass Wafers and Fused Silica Wafers
- Glass Wafer Types: Fused Quartz & Silica, Borosilicate, Alumino Silicate
- Fused Quartz wafers, JGS2 and single crystal Quartz Wafers
- Available in 2″ to 200mm Diameters or Rectangular Sizes
- Double Side Polished, Thickness ≥200 µm
- Custom Coatings, Processing and Dicing
- Supply and Shipment Worldwide from Stock