| Work piece size | Maximum 200mm×200mm (Contact us if you want to handle more than 200mm） |
| Scanning method | XY scanning or Rotation scanning |
| Inspection time | Φ200mm (X-Y) Approx. 4min Φ200mm (Θ) Within 2min Φ1500mm (Θ) Within 1min 30sec Φ100mm (Θ) Within 1min |
| Work piece setting | Manual |
| Dimension | W900ｍｍ×D1,000ｍｍ×H1,707ｍｍ |
| Weight | Approx. 800 KG |
| Power Consumption | Approx. 2.0 KW (100V) |
| Target substrate | Silicon wafer, Transparent substrate, Sapphire substrate, LT wafer, SiC wafer, etc |
| Maximum sensitivit | Transparent substrate 0.2μｍ Silicon wafer 0.1μｍ |
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YPI-MX Series (Manual)
YPI-MX-XY/YPI-MX-Θ
Glass substrate/ Sapphire wafer surface inspection system
YPI-MX series（Manual）
Specialized to tune for a transparent substrate. Apply to measure a rough polishing of back of substrate.
