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Entrepix’ OEM-level upgrades provide greater efficiency, accuracy, and reliability.
Spectroscopic ellipsometers can be configured to cover a wide wavelength range from DUV to NIR. The DUV range is useful for measuring ultra-thin films, such as in the nanometer thickness range. The deep UV range is also essential if you need to measure the band gap of a material or the measurement of native oxides on silicon wafers with a thickness of about 1 to 2 nm, while the visible or near-infrared range is used for measurements of relatively thick or very thick thin film coatings.
Spectroscopic ellipsometers can be configured to cover a wide wavelength range from DUV to NIR. The DUV range is useful for measuring ultra-thin films, such as in the nanometer thickness range. The deep UV range is also essential if you need to measure the band gap of a material or the measurement of native oxides on silicon wafers with a thickness of about 1 to 2 nm, while the visible or near-infrared range is used for measurements of relatively thick or very thick thin film coatings.
SR · SE is a Combo Metrology that integrates a reflectometer and an ellipsometer into one device.
It is a hybrid thin-film measuring device that maximizes measurement ability and utilization to enable high-level research and development purposes and simple repetitive measurement work by combining the advantages of reflectometer and ellipsometer. In order to supplement the measurement accuracy of SR (Reflectometer), which is generally less reliable in measuring thin films of several nanometers or less, a separate SE (Ellipsometer) is used for Å level thickness measurement, material-specific optical constants (n, k) measurement, and material characterization. measured using it. FILCON SR · SE is a cost-effective and powerful multi-purpose thin film measurement instrument that integrates SE’s unique precision measurement and analysis capabilities and SR’s ease of use into one instrument .
FILCON SR-FAB is a full-automatic spectroscopic reflectance measurement equipment for semiconductor clean rooms that can automatically measure the thickness (t), reflectance, and transmittance of transparent thin films of several nanometers to several tens of mm by calling a pre-written mapping recipe from upper host communication. is. It meets the optimal automated metrology measurement requirements for in-line remote measurement with various options that enable micro-area target measurement of pattern wafers. It is possible to configure a unique low-cost system in the form of fully automated all-in-one metrology optimized for small wafers under 8” and various customized in-situ automated metrology equipment based on EFEM consisting of SMIF, multiple load ports and state-of-the-art transfer robots.
FILCON SR-300S is a micron-level precision XY stage and granite plate that can automatically measure the thickness (t), reflectance, and transmittance of transparent thin films of several nanometers to several tens of mm with a pre-written mapping measurement recipe using vertically incident light. It is a stand-alone automatic non-contact spectroscopic reflection measurement equipment with a rigid structure based metrology frame. It is equipped with advanced spectroscopic measurement options such as auto-focus and vision PRS pattern matching for precise measurement of micro-regions of wafer patterns, enabling precise measurement .
Cost-effective all-in-one SR measurement equipment for research and development ·
of thickness, reflectance and transmittance of thin films
Measure the measurement area while watching the live camera image.
Nano-level thin film thickness measurement and image XY dimension measurement are possible.
Provides powerful measurement function in a compact equipment configuration.
Simple and easy Windows GUI measurement program
● Product name:FOSB
● Part number:SH-B300
● Dimension:389(L) x 340(W) x 331(H)mm
● Capacity:25 PCS
● Apply for round wafer:300mm(12 inch)Wafer
● Material:Customized
● Product name:FOUP Adapter
● Part number:AD-F200
● Dimension:440(L) x 347(W) x 337(H)mm
● Weight:
● FOUP size:300mm(12 inch) FOUP
● Material:Customized
● Product name:CK300 FOUP
● Dimension:440(L) x 347(W) x 337(H)mm
● Capacity:25 PCS
● Apply for round wafer:300mm(12 inch)Wafer
● Material:Customized
● Slot pitch:10 mm
● Product name:CKH300 FOUP
● Dimension:440(L) x 347(W) x 337(H)mm
● Capacity:13 PCS
● Apply for round wafer:300mm(12 inch)Thin Wafer
● Material:Customized
● Slot pitch:20 mm
● Product name:IH300 FOUP
● Dimension:440(L) x 347(W) x 337(H)mm
● Capacity:13 PCS
● Apply for round wafer:300mm(12 inch)Thin Wafer
● Material:Customized
● Slot pitch:20 mm