| Wafer Size | 125×125 mm and 156×156 mm and up to 230 mm |
| Accuracy | ±0.5µm |
| Resolution | 0.1µm |
| Thickness range | 100 – 300 µm |
| Software | EHMaster |
Roll over image to zoom in
MX 152/153
Application
OEM integrated thickness and resistivity gauge for 125 mm, 156 mm up to 230 mmm solar wafers.
The MX152/153 is an in-line module for belt-transported wafers. It gauges thickness, flatness (TTV) and optionally resistivity and P/N dotation on the fly between automated manufacturing processes. Consists of Measurement module, electronic rack and controlling computer. Measurement values will be tranfered to a host computer by ethernet and TCP/IP.
Measurement type
Thickness | Flatness (TTV) | Resistivity| P/N Dotation
