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Diamond Wire-Wafer Slicing
- High throughput & Superior cutting quality
- Reduced process lead time and kerf loss
- Enhanced flatness of cut materials and superior warp, TTV and Bow values
- Applicable for thin wafer slicing – Through uniform diamond grit
- Longer wire lifetime – Excellent diamond retention & no wire breakage
- Faster cutting speed – 3~10 times compared with slurry process
- Low cost and eco-friendly – Slurry free process