Our insert lapping carriers significantly improve Total Thickness Variation. Using a unique combination of customized design and high-quality materials, the wafers are afforded greater freedom of rotation, which reduces TTV during the lapping or polishing process.
We offer insert lapping engineering from a variety of different high-grade plastics to meet the widest possible range of processing functions.
With PR Hoffman Insert Carriers, you get:
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- Custom designs we create, or we can put your own design ideas to work for you
- Custom materials featuring our own licensed and patented designs
- Carriers molded from proprietary grades and blends of long-lasting polymer
- A wide selection of high-quality spring and stainless steels
- Wafer sizes ranging from 100 mm to 450 mm in diameter
- Used for silicon, sapphire lapping and compound substrate wafers
