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Chemically Resistant Templates, specially designed for harsh environments and the extreme pH levels of slurry for polishing Silicon Carbide (SiC), are the latest innovation in polishing fixtures that PR Hoffman has to offer. CXTs can be used in any polishing application, flip polish, touch polish, single-side polish, or CMP. This product helps to save both time and money with longer lifetime, improve machine and wafer cleanliness, and reduce change over down time. With the seamless single shell construction, it prevents slurry incursion and improves COO. This product has been proven to withstand environmental and processing temperature variations and extreme levels of pH.
PR Hoffman is recognized as a leading innovator and manufacturer of Insert Carriers, also known as Polishing Carriers, for the semiconductor wafer industry. The insert carrier is an exclusive PR Hoffman design widely used in the semiconductor industry (and other high value wafer industries) to protect the edge profile of the wafer while providing the strength and durability of a traditional steel carrier.
Custom Designs for Semiconductor Processing
PR Hoffman generates a custom drawing for customer review and approval before any products are made. This added service ensures that our customers receive precisely the design needed for their process, on every order.
We manufacture lapping carriers (also called workholders) for planetary lapping and polishing machines including those manufactured by P.R. Hoffman, Speedfam, Peter Wolters AG, Hamai, Somos, Fujikoshi, Strausbaugh, Melchiorre, Lanzhou, Lapmaster and other specialty machines adapted for unique applications. Lapping carriers are available in a variety of materials and thicknesses, including an inventory of more than 20 spring steel thicknesses.
We can create a custom drawing that you can review to ensure the design meets your exact specifications. If you have a drawing or sample part for a lapping or polishing process, PR Hoffman can provide a detailed quotation for your review.
PR Hoffman uses a wide variety of state of the art manufacturing methods to create your lapping carriers including, precision punching, Wire-EDM cutting, CNC machining, CNC routing, and laser cutting. With these options, nearly any lapping carrier configuration is available. We will recommend the most cost-effective method based on your machine and volume requirements.
PR Hoffman works with each customer to achieve an approved design so you can be sure the template you receive will meet your physical specifications and perform well in your unique processing environment. Templates can be used in any polishing application, flip polish, touch polish, single-side polish, or CMP. This product can help to save both time and money by eliminating the repetitive work required when wax mounting, de-mounting, and then cleaning the wax from the part. PR Hoffman custom manufactures template assemblies for any single-side process such as Silicon wafers, Silicon Carbide (SiC) wafers, compound substrate wafers, glass wafers, ceramics, and glass along with virtually any flat and parallel part that requires a polished surface.