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MX 204-8-73-Q
Application
Automatable geometry gauge for 125–156mm solar wafers.The MX204-8-49-q works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 49 measuring points it controls thickness, bow and warp in high resolution. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp | sori -
MX 301-8
Application
Easy one-point thickness gauge for 30–200mm silicon wafers.The MX301 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With customized exchangeable shims and an easy one-click calibration. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness -
MX 301-AC
Application
Easy one-point thickness gauge for 30–200mm semiconducting and metallic materials.The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display.Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness -
MX 301-Q
Application
Easy one-point thickness gauge for 30–200mm non-conductive wafers.The MX301-Q is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of wafers consisting of insulating materials like quartz, sapphire or glass. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness -
MX 3012
Application
Easy one-point thickness gauge for 75–300mm silicon wafers.The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With an easy one-click calibration. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness -
MX 3012-AC
Application
Easy one-point thickness gauge for 75–300mm semiconducting and metallic materials.The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness -
MX 3014
Application
Easy one-point thickness gauge for thin, framed 200mm and 300mm silicon wafers.The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge. Especially for thin wafers, unframed and framed with dicing tape or backgrind tape. Simple handling without the tape thickness nor the tape’s dielectric constant. Light barriers avoid mismeasurement at the edges. Fully self-calibrating without the need for gauge blocks nor reference wafers. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness -
MX 302
Application
The MX 302 measures a high resulution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.
Measurement type
Thickness -
MX 601
Application
Fast contactless resistivity gauge for semi-insulating wafers up to 150mm.The MX601 gauges resistivity of wafers made of semi-insulating materials like Gallium Arsenide or Silicon Carbide. Fast handling without wafer preparation and excellent repeatability with best avoidance of piezo-electric effects. MX601’s serial interface allows data evaluation and statistics, as well as access to calibration constants and output types.
Measurement type
Thickness -
MX 6012
Application
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.The MX6012 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. In addition to the center measurement, up to 15 additional points for each half scan can defined. Optionally an identical scan after 90° rotation. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 604
Application
Fast contactless resistivity gauge for silicon blocks.The MX604 gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4
different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface. Our optional software EHMaster allows further evaluation of the measurements and configuration
of the tool.
Measurement type
Thickness -
MX 604-B
Application
Portable contactless resistivity gauge for silicon blocks.The MX604-B gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4 different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Powered by rechargable battery. With energy-saving automatic stand-by mode. Intended as portable stand-alone version of MX604.
Measurement type
Thickness