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MX 601
Application
Fast contactless resistivity gauge for semi-insulating wafers up to 150mm.
The MX601 gauges resistivity of wafers made of semi-insulating materials like Gallium Arsenide or Silicon Carbide. Fast handling without wafer preparation and excellent repeatability with best avoidance of piezo-electric effects. MX601’s serial interface allows data evaluation and statistics, as well as access to calibration constants and output types.
Measurement type
Thickness -
MX 6012
Application
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.The MX6012 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. In addition to the center measurement, up to 15 additional points for each half scan can defined. Optionally an identical scan after 90° rotation. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 604
Application
Fast contactless resistivity gauge for silicon blocks.
The MX604 gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4
different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface. Our optional software EHMaster allows further evaluation of the measurements and configuration
of the tool.
Measurement type
Thickness -
MX 604-B
Application
Portable contactless resistivity gauge for silicon blocks.
The MX604-B gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4 different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Powered by rechargable battery. With energy-saving automatic stand-by mode. Intended as portable stand-alone version of MX604.
Measurement type
Thickness -
MX 604-S
Application
Fast sheet resistance gauge for 50–200mm silicon wafers and conductive films.
The MX604-S gauges sheet resistance of semiconducting wafers and conductive films on high-ohm substrates with the reliable eddy current method. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Sheet resistance -
MX 604-ST
Application
Combined thickness and resistivity gauge for up to 156mm solar wafers
The MX604-ST is designed to characterize solar wafers. Fits square wafers up to 156mm and round wafers from 2″ to 200mm. It combines sensors for measuring thickness and resistivity simultaneously. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Resistivity -
MX 608
Application
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.
The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 7012
Application
High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.
The MX7012 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
MX 7018
Application
The MX7018 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
Robot Sorters
- Customization high-end
Your requirements – your tool. Our Robot Sorters are designed as a completely modular principle: individual inline measurements with our field-proven MX systems, fully automatic robotic sorting, aligner and carrier stations, tracks, cassette stations and many more. ore than 250 of these individual robot sorters have been developed for our customers and integrated into the process chain. Safety, repeatability and extremely low maintenance times are always our top priorities. And all this with an extraordinary throughput. - All measurements and requirements in one system for up to 200 WPH
- Flexible integration of the required components
- Long lifetime & low maintenance
- Extremely short production time, individual support
- Almost all types of wafers: 150-200 mm, 300 mm, Taiko etc.
- International calibration standards, SEMI standards
- Customization high-end
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SW1215
Compact wire saw with easy change-over, suitable for high-mix low-volume production
This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets
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SW1730D
Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed
This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.Target workpieces: SiC, GaN, Sintered materials, Sapphire