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MX 604-B
Application
Portable contactless resistivity gauge for silicon blocks.
The MX604-B gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4 different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Powered by rechargable battery. With energy-saving automatic stand-by mode. Intended as portable stand-alone version of MX604.
Measurement type
Thickness -
MX 604-S
Application
Fast sheet resistance gauge for 50–200mm silicon wafers and conductive films.
The MX604-S gauges sheet resistance of semiconducting wafers and conductive films on high-ohm substrates with the reliable eddy current method. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Sheet resistance -
MX 604-ST
Application
Combined thickness and resistivity gauge for up to 156mm solar wafers
The MX604-ST is designed to characterize solar wafers. Fits square wafers up to 156mm and round wafers from 2″ to 200mm. It combines sensors for measuring thickness and resistivity simultaneously. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Resistivity -
MX 608
Application
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.
The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 7012
Application
High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.
The MX7012 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
MX 7018
Application
The MX7018 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
New BSL CMP Pad Conditioner
- Strong diamond holding force : Chemical reaction + Mechanical contact
- Corrosion resistance : Carbide interface between diamond & bond material
- Longer lifetime : Utilization of edges by diamond face
- Maximized diamond chip pocket by high diamond exposure
- Excellent conditioning efficiency and pad debris removal rate
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Platen Refurbishment
Entrepix provides a full, turn-key refinish and refurbishment service for CMP platens of all shapes and sizes.
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Polishing Templates
PR Hoffman works with each customer to achieve an approved design so you can be sure the template you receive will meet your physical specifications and perform well in your unique processing environment. Templates can be used in any polishing application, flip polish, touch polish, single-side polish, or CMP. This product can help to save both time and money by eliminating the repetitive work required when wax mounting, de-mounting, and then cleaning the wax from the part. PR Hoffman custom manufactures template assemblies for any single-side process such as Silicon wafers, Silicon Carbide (SiC) wafers, compound substrate wafers, glass wafers, ceramics, and glass along with virtually any flat and parallel part that requires a polished surface.
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Refurbishment Services
Entrepix remanufactured equipment provides the performance of brand new equipment with costs that fit your budget
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Robot Sorters
- Customization high-end
Your requirements – your tool. Our Robot Sorters are designed as a completely modular principle: individual inline measurements with our field-proven MX systems, fully automatic robotic sorting, aligner and carrier stations, tracks, cassette stations and many more. ore than 250 of these individual robot sorters have been developed for our customers and integrated into the process chain. Safety, repeatability and extremely low maintenance times are always our top priorities. And all this with an extraordinary throughput. - All measurements and requirements in one system for up to 200 WPH
- Flexible integration of the required components
- Long lifetime & low maintenance
- Extremely short production time, individual support
- Almost all types of wafers: 150-200 mm, 300 mm, Taiko etc.
- International calibration standards, SEMI standards
- Customization high-end
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Spare Parts for AMAT Reflexion
Entrepix provides parts, upgrades, service, and refurbishment services and refurbished tools for the Applied Materials Reflexion® 3600, Reflexion LK 3800, Reflexion LK Prime®, and Reflexion LK Prime® S integrated CMP tools.