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Epoxy Molding Material
KMC series
KMC series, Shin-Etsu Chemical’s semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications. -
Liquid Epoxy Encapsulation Material
SMC series
SMC series are liquid epoxy encapsulation materials developed for potting materials, adhesives, and underfill materials for semiconductor devices.
The semiconductor device which is protected by this encapsulation material has excellent electrical properties and moisture resistance.
In addition, the low stress properties by using silicone which is Shin-Etsu Chemical’s original technology, shows excellent properties in heat resistance. -
Silicone Molding Compound
SGC series
Shin-Etsu Chemical is offer silicone molding compound which can be thermosetting transfer molding system for electric and electronic parts. It is contained various fillers and additives based on silicone resin. It has excellent heat resistance, cold resistance and degradation resistance. It is shown stable electrical insulation performance because it is not changing properties by temperature and frequency. In addition, mold releasability is excellent.
Shin-Etsu responds to molding material that requires high heat resistance.