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DW160S
Easy-to-use compact single wire saw
This fixed abrasive single wire saw is ideal for segmented and sample cutting of various types of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
It is compact and easy to operate. (Maximum workpiece size: 8 inches)
Target workpieces: Silicon, Quartz, Fluorite, Tungsten carbide -
DW340S
Single wire saw capable of cutting long workpieces
This fixed abrasive single wire saw is ideal for segmented and sample machining of a variety of ingots. It improves material yield by reducing kerf loss and chipping compared to conventional band saws.
An optional goniometer stage and Y-axis table for back and forth functions are available.
(Maximum workpiece size: 13 inches)
Target workpieces: Silicon, quartz, fluorite, tungsten carbide -
HW1215
Highly-accurate high-speed machining with high workability and high wire speed
This high spec wire saw supports various materials, and it’s automatic wire winding mechanism enhances workability.
Compact while providing high wire speed, this machine allows for high production efficiency in a small footprint.
It also reduces running costs by minimizing consumable supplies.
Target workpieces: Sintered materials, Rare-earth materials, Compound semiconductors -
HW810
Highly-accurate, high-speed slicing of hard materials up to 8 inches with ultra-high wire speed
This diamond wire saw has the industry’s fastest wire speed of 3,000 m/min, which significantly reduces processing time, warpage, and wire usage. It also supports 8-inch down-cutting, contributing to lower CoO.
Target workpieces: SiC, GaN, Sintered materials -
SW1215
Compact wire saw with easy change-over, suitable for high-mix low-volume production
This compact wire saw has high workability, supporting various materials with small diameters.
This hybrid machine supports both diamond wire sawing and slurry wire sawing.
Target workpieces: Iridium, Ceramic, Ferrite, Neodymium magnets -
SW1730D
Wire saw that can perform high-tension machining of hard materials up to 6 inches with high linear speed
This diamond wire saw is capable of highly-accurate slicing with a narrow main roller pitch for workpieces up to 6 inches.
Highly-accurate high-speed slicing is possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, as well as high wire speeds and main roller oscillation.
Target workpieces: SiC, GaN, Sintered materials, Sapphire -
SW2230D
Wire saw capable of high-tension slicing with high wire speed for hard materials up to 8 inches
Diamond wire saw capable of high-accuracy slicing with narrow center distance, supporting workpieces up to 8 inches.
Highly-accurate and high-speed slicing is made possible by using highly-rigid casting beds, columns, and roller holders that are capable of withstanding high-tension high-speed slicing, high wire speeds, and main roller oscillation.
Target workpieces: SiC, GaN, Sintered materials, Sapphire -
SW3020
Wire saw for highly-accurate slicing required in high precision crystal materials
This wire saw precisely cuts brittle materials.
Higher precision slicing is made possible by improved main roller and coolant temperature control.
Target workpieces: Crystal, LT/LN, Sintered materials -
SW630D
Highly-accurate high-speed slicing using down-cutting, High workability with 3 side operational approach
6 inch down-cut machine with the minimum wire slack made possible by using the industry’s narrowest main roller pitch. In spite of having the smallest number of wire guide rollers, this wire saw has high rigidity to withstand high-tension high-speed slicing.
Slurry and diamond wire types are available.
Target workpieces: LT/LN, GaAs/InP/Ge, Sintered materials -
SW830D
Wire saw capable of cutting up to 8 inches with high-accuracy and high-speed slicing using down-cut
Capable of performing 8 inch down cutting with high-tension high-speed slicing, while using the industry’s smallest number of wire guide rollers. This is possible thanks to its high-rigidity design.
Slurry and diamond wire types are available.
Target workpieces: LT/LN, GaAs/InP, Sintered materials, Neodymium magnets -
UD150
Compact wire saw capable of highly accurate dicing with high workability
This wire saw is super compact with high workabitlity, which makes it suitable for dicing and wide pitch slicing.
Designed to be compact but rigid, it allows for high wire speed and high tension for highly accurate slicing.
Target workpieces: Crystal, pipe materials, Rare-earth materials