6 Inch Plastic Wafer Frames TJF-6P-2.5

Material: ABS

Dimensions: Width 211mm
Outer Diameter Ø226.7mm
Inside Diameter Ø195mm

Plate Thickness: 2.5±0.15mm

6 Inch Plastic Wafer Frames TJF-6P-2.5

  1. Plastic Wafer Frame/ Plastic Dicing Ring/ Tape Frame
  2. Made of ABS
  3. The product is lightweight and durable.
  4. Suitable for semiconductor industry, wafer, electronics industry, clean room
  5. We provide customized services for stainless steel wafer frame, and the size can be adjusted according to your needs.

India Handotai specializes in the design and production of high-precision plastic wafer frames for semiconductor applications. The TJF-6P-2.5 model is engineered for 6-inch wafers, offering excellent dimensional stability and compatibility with various dicing and packaging processes. As a leading semiconductor frame manufacturer in Taiwan, we ensure consistent quality and performance for every product.

In addition, we provide customized stainless-steel wafer rings for 6-inch, 8-inch, and 12-inch wafers. Our customization options include polished or matte finishes, engraved markings, and tailor-made designs developed to meet specific customer requirements.

Our cooperation customers: Amkor、ASE、KLA、TSMC、ABB.

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