| Package Type | Chase Q’ty | Pot Q’ty | Experience | Maker | |
|---|---|---|---|---|---|
| 1 | SSOP 16, 20, 38 LEAD | 1 | 8 | 8 | TOWA |
| 2 | HTSSOP 64 LEAD | 1 | 4 | 3 | TOWA |
| 3 | LQFP 20X20 | 1 | 10 | 4 | TOWA |
| 4 | LQFP 14X14 | 1 | 3 | 4 | TOWA |
| 5 | QFP 48 | 1 | 8 | 2 | YAMADA |
| 6 | SOP 8 HIGH DENSITY | 1 | 8 | 3 | DAI ICHI |
| 7 | TSSOP 8 HIGH DENSITY | 1 | 8 | 2 | DAI ICHI |
| 8 | TSSOP 16 HIGH DENSITY | 1 | 8 | 3 | DAI ICHI |
| 9 | DFN 5X5 | 1 | 8 | 6 | TOWA |
| 10 | XDFN | 1 | 8 | 8 | FICO |
| 11 | ULTRA DFN | 1 | 6 | 6 | ASM |
| 12 | BGA & LGA | 1 | 8 | 53 | ASM, TOWA, YAMADA |
| 13 | SOT23 HIGH DENSITY | 1 | 3 | 4 | YAMADA |
Automold Chase & Conversion Kit
● Maintain existing facilities and manufacturing necessary parts for package conversion
● Equal quality at a lower cost compared to original production
● Rich history of production of molds and Conversion kits from many Automold Major companies
Category: Encapsulation
Tag: G.S Tech - Korea







