- High flatness and great elongation for wafer back grinding / thinning protection, substrate cutting.
- For uneven surface masking protection.
- Acid and alkali-resistance : PH 3 ~ PH10.
- Lift-off cleaning.
| Model | Material | Physical Property | Applications | ||
| POY143 | PO + Liner | Total Thickness | 170 | µm | Wafer back grinding / thinning |
| Adhesion | 0.15±0.1 | kg/in | |||
| POR146 | PO + Liner | Total Thickness | 170 | µm | Wafer back grinding / thinning |
| Adhesion | 0.35±0.1 | kg/in | |||
| POL803 | PO + Liner | Total Thickness | 95 | µm | Wafer dicing, substrate cutting Lift-off cleaning |
| Adhesion | 0.2±0.1 | kg/in | |||
| POL804-2 | PO + Liner | Total Thickness | 87 | µm | Wafer back grinding / thinning Substrate cutting |
| Adhesion | 0.06~0.12 | kg/in | |||
| POL835 | PO + Liner | Total Thickness | 93 | µm | Die cutting protection |
| Adhesion | 0.3~0.5 | kg/in | |||
| POU200 | PO + Liner | Total Thickness | 200 | µm | For bumped wafer |
| Adhesion | 0.3±0.2 | kg/in | |||
