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UV Dicing Release Tape
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UV Dicing Release Tape

UV Release Tape, Wafer Dicing Tape
UV Tape / UV Dicing Tape(Film) / UV Irradiation Tape(Film)
Model : UET / UPT
Categories: , , ,
  • After UV light exposure (with certain wave length), the adhesion is greatly reduced
    (irreversible reaction), the object can be easily removed and picked up.
  • Good for heat resistant purposes.
  • Used in wafer back grinding, chip dicing, MLCC cutting, LED dicing, lens dicing, nameplate cutting and any substrate cutting.
  • Anti-static version is available.
Model Material Physical Property Applications
UET101 PET Film+Liner  Total Thickness 125 µm  Semiconductor dicing
Before UV release 2↑ kg/in
After UV release 0.03↓ kg/in
UET113P PET Film+Liner  Total Thickness 110 µm
Before UV release 0.9 ↑ kg/in
After UV release 0.03 ↓ kg/in
UET123P PET Film+Liner  Total Thickness 125 µm
Before UV release 2.0 ↑ kg/in
After UV release 0.03↓ kg/in
UPT155 PO Film+Liner  Total Thickness 170 µm
Before UV release 1.2↑ kg/in
After UV release 0.05 ↓ kg/in
UPT152-11 PO Film+Liner  Total Thickness 170 µm
Before UV release 1.2↑ kg/in
After UV release 0.05↓ kg/in

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