- LED production process, high temperature release at 240~260°C.
- Front end matelization process.
- Improving production process, no residue after releasing components.
| Model | Material | Physical Property | Temp. | ||
| FCL72625 | PI Film w/ Liner | Total thickness | 80 ± 5 | um | Release Temperature 240~260℃ , 3-5 min |
| Adhesion Before Heating |
0.6 ↑ | kg/in | |||
| Adhesion After Heating |
0.015↓ | kg/in | |||
| SDF72425 | PI Film Double side thermal release adhesive |
Total thickness | 135 ± 7 | um | Release Temperature 240~260℃ , 3-5 min |
| Before heating adhesion | 0.5 ↑ | um | |||
| After heating adhesion | 0.015 ↓ | kg/in | |||
