| Wafer Diameter | 150mm, 200mm |
| Thickness | 500 – 800 μm |
| Max. Warp | 100 μm |
| Resistivity | 0.001 – 200 Ohm·cm |
| Type check | 0.020 – 200 Ohm·cm |
| Software | EHMaster |
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MX 608
Application
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.
The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness
