YPI-MX-XY/YPI-MX-Θ
Glass substrate/ Sapphire wafer surface inspection system
YPI-MX series（Manual）
Specialized to tune for a transparent substrate. Apply to measure a rough polishing of back of substrate.

New designed detection units which are cross setting with dual 355nm (UV) laser.
The dual detector contributes enhanced detection for a slight scratch generated directional light scattered compared with conventional particle inspection system.
And also, 355nm laser is effective for isolated detection of SiC surface only.
Inspection time is within 5min for 4inch SiC wafer.