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Back Grinding Wheel – Nano Pol
- Wafer surface roughness and die strength can be improved
- Grinding stress and wafer edge chipping can be reduced
- Diamond at the tip can be distributed consistently
- Porosity, pore shape and pore size control can be adjusted
- Possible to grind Si wafer up to 17㎛ (Ultra thin wafer)
- Outstanding grinding ability for TSV and normal(for finger print) compound wafer
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Back Grinding Wheel – Resin
- Rough grinding (Z1)-(#325~600)
- Less edge chipping and grinding damage on thin wafer
- Excellent grinding ability without compromising wheel life time
- Fine grinding ( Z2 )-( #2000 ~ #4000 )
- Easy grinding with low and consistent grinding current
- Considerably longer life time than competitor’s
- #3000~#4000 : Superior surface roughness and minimized sawing mark
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Back Grinding Wheel-Metal
- Leading technology in various types of machines and applications
- Rough wheel (Metal bond) : Long life time and excellent bulk removal rate
- Fine wheel (Vitrified bond) : Superior grinding ability and roughness
- Providing proper wheel designs for various grinding methods and proper recipes
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CVD CMP Pad Conditioner
- Various patterns can be arranged CVD diamond coated tips
- Apex of the CVD diamond coated tip is flat face
- Allows to engineer the critical pressure applied to each tip for pad conditioning
- EHWA has a patents on the tip size and number for pad conditioning
- The apex where contacts the pad has not changed over the conditioning time
- Pad cut rate is constant
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Diamond Wire – Squaring
- High throughput & Superior cutting quality
- Reduced process lead time and kerf loss
- Enhanced flatness of cut materials and superior warp, TTV and Bow values
- Applicable for thin wafer slicing – Through uniform diamond grit
- Longer wire lifetime – Excellent diamond retention & no wire breakage
- Faster cutting speed – 3~10 times compared with slurry process
- Low cost and eco-friendly – Slurry free process
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Diamond Wire-Wafer Slicing
- High throughput & Superior cutting quality
- Reduced process lead time and kerf loss
- Enhanced flatness of cut materials and superior warp, TTV and Bow values
- Applicable for thin wafer slicing – Through uniform diamond grit
- Longer wire lifetime – Excellent diamond retention & no wire breakage
- Faster cutting speed – 3~10 times compared with slurry process
- Low cost and eco-friendly – Slurry free process
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Dicing Blade
- High accuracy, super thin blade developed by Shinhan Diamond
- Minimized chipping and superior consistence in quality through stringent particle
- Size distribution control
- Improve productivity by high feed speed
- Providing an optimized solution to the customers
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Edge Grinding Wheel
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Edge Grinding Wheel
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Edge Grinding Wheel-Metal
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Electroformed Micro Blade
- High accuracy
- Ultra-thin hub-less blade (~50um) vs Metal bond micro blade (>100um)
- Cutting any hard materials (ex Ceramic package, LTCC, HTCC)
- Advantages of cutting PKG with high abrasive content
- High yield long life time
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Electroplated CMP Pad Conditioner
- Mechanical Bonding (Ni plating)
- Excellent disk flatness : Superior wafer uniformity
- Clean disk surface : Near zero micro scratches.
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Electroplated Wheel
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Micro Blades-Metal
- High precision thin with superior cutting efficiency
- Maintains free cutting action at high RPM and fast feed rates
- Eliminate chipping during the sawing operation
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Micro Blades-Resin
- High precision thin with superior cutting efficiency
- Maintains free cutting action at high RPM and fast feed rates
- Eliminate chipping during the sawing operation
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New BSL CMP Pad Conditioner
- Strong diamond holding force : Chemical reaction + Mechanical contact
- Corrosion resistance : Carbide interface between diamond & bond material
- Longer lifetime : Utilization of edges by diamond face
- Maximized diamond chip pocket by high diamond exposure
- Excellent conditioning efficiency and pad debris removal rate
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Notch Grinding Wheel
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Notch Wheel (Si)
- Various groove shapes can be designed.
- Grinded with uniform chamfer width (excellent rigidity)
- Strong groove shape retention.
- Product 1ea enables multi-stage grinding ( rough / fine grinding)
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Polishing Wheel
- Higher removal rate than competitor’s wheel (High throughput)
- Superior surface roughness (stronger edge strength)
- Longer life time (Low Cost of Consumables and Reduced wheel change time)
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Polishing Wheel – DP
- Applying dry polishing after processing wafer with back grinding wheel.
- Mirror surface processing by using soft wool felt and ZrO2 250mm for improving roughness.
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Polishing Wheel-GDP
- Applying dry polishing after processing wafer with back grinding wheel.
- Improving roughness and realizing gathering effect by applying spherical silica.
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Scribing Wheel
- Stable performance through automatic manufacturing system
- Excellent edge strength of glass (minimum defects)
- All range of application in various of glass thickness