- Description : Applied with Jet Dispensing fluid glue(such as Epoxy, etc…) in LED hi-power-chip Die-Bonding Process
- Application : Manual or Auto Dispenser machines, such as Musashi, NEC, etc…
- Meterial : Nickel alloy
- Spectification : 1. Standard types, 2. Customer-made for Customers’ needs.
- Description : Applied to Sealant Patterning glue of LCD(Liquid Crystal Display) Cell Process
- Application : HITACHI Automatic Dispensing Machine
- LCD Factory Generations : 3G, 4G, 5G, 6G, 7G
- Meterial : Nickel alloy
- Spectification : 1. Standard types, 2. Customer-made for Customers’ needs.
- Description : Applied with Dispensing fluid glue(such as Epoxy, etc …) in IC-package Die-Bonding Process
- Application : Any brands of Auto Dispenser machines
- Meterial : Nickel alloy
- Spectification : 1. Standard types, 2. Customer-made for Customers’ needs.
