- De taping non UV release wafer back grinding tape.
- Peeling off large surface protection film on screen or device.
- High cleanness and anti-static for semiconductor industry.
| Model | Material | Physical Property | Applications | ||
| ETT293 | PET | Total Thickness | 55 | µm | Wafer de-Taping Tape Custom long length for fitting de-taping machine. Or peeling off large adhesive film |
| Adhesion | 1.2↑ | kg/in | |||
| ETT548R | PET | Total Thickness | 61 | µm | |
| Adhesion | 0.002~0.006 | kg/in | |||
| ETT588R-5 | PET | Total Thickness | 85 | µm | |
| Adhesion | 1.2↑ | kg/in | |||
| GTT601RAS | PET | Total Thickness | 90 | µm | Anti-Static PSA: 108~1011 ~ Ω/sq. Film: 106~109 ~ Ω/sq. |
| Adhesion | 0.7 | kg/in | |||
| SAT293 | PET | Total Thickness | 53 ± 3 | µm | Anti-Static Film: 104~108 ~ Ω/sq. |
| Adhesion | 1.0↑ | kg/in | |||
