De-Taping Tape

Product Detail
Model : ETT / SAT
♠ De taping non UV release wafer back grinding tape.
♠ Peeling off large surface protection film on screen or device.
♠ High cleanness and anti-static for semiconductor industry.
Model | Material | Physical Property | Applications | ||
ETT293 | PET | Total Thickness | 55 | µm | Wafer de-Taping Tape Custom long length for fitting de-taping machine. Or peeling off large adhesive film |
Adhesion | 1.2↑ | kg/in | |||
ETT548R | PET | Total Thickness | 61 | µm | |
Adhesion | 1.5↑ | kg/in | |||
ETT588R-5 | PET | Total Thickness | 85 | µm | |
Adhesion | 1.2↑ | kg/in | |||
GTT601RAS | PET | Total Thickness | 90 | µm | Anti-Static PSA: 108~1011 ~ Ω/sq. Film: 106~109 ~ Ω/sq. |
Adhesion | 0.7 | kg/in | |||
SAT293 | PET | Total Thickness | 53 ± 3 | µm | Anti-Static Film: 104~108 ~ Ω/sq. |
Adhesion | 1.0↑ | kg/in | |||



