- Used in QFN molding process, to avoid EPOXY bleeding.
- Polyimide film coated with special formulated silicone adhesive.
- Consistently stable at high temperature, no residue after peeling off.
- 260°C high temperature resistance.
| Product Code | Product Description | Physical Property | Applications | ||
|---|---|---|---|---|---|
| KAL278 | PI Film w/ liner | Total Thickness | 33 | um | QFN molding process |
| Adhesion | 0.1 | kg/in. | |||
