- Curing with UV light exposure (with certain wavelength), the adhesion is greatly reduced (irreversible reaction), the object is then easily removed or picked up.
- Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, DFN dicing or lead frame cutting.
- Anti-static on adhesive or film.
- Low energy release, speed up the production process.
| Ｍodel | Material | Physical Property | Applications | ||
| UPT641-4 | PO film with Anti-static adhesive |
Total Thickness | 160 ± 9 | μm | Chip, substrate or DFN dicing |
| Before UV | 1.8↑ | kg/in | |||
| After UV | 0.05↓ | kg/in | |||
| UPT152-AS | Anti-static PO Film | Total Thickness | 170 ± 9 | μm | Chip dicing, substrate dicing |
| Before UV | 1.2↑ | kg/in | |||
| After UV | 0.03↓ | kg/in | |||
